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Comparison Asus PRIME B760-PLUS D4 vs Asus PRIME B660-PLUS D4

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Asus PRIME B760-PLUS D4
Asus PRIME B660-PLUS D4
Asus PRIME B760-PLUS D4Asus PRIME B660-PLUS D4
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Featuresfor home/officefor home/office
SocketIntel LGA 1700Intel LGA 1700
Form factorATXATX
Power phases8
VRM heatsink
Size (HxW)305x244 mm305x244 mm
Chipset
ChipsetIntel B760Intel B660
BIOSAmiAmi
UEFI BIOS
RAM
DDR44 slot(s)4 slot(s)
Memory moduleDIMMDIMM
Operation mode2 channel2 channel
Max. clock frequency5066 MHz5066 MHz
Max. memory128 GB128 GB
XMP
Drive interface
SATA 3 (6Gbps)44
M.2 connector33
M.22xPCI-E 4x, 1xPCI-E 2x2xPCI-E 4x, 1xPCI-E 2x
Interface version M.23x4.0
M.2 SSD cooling
Integrated RAID controller
 /0/1/5/10/
Expansion slots
1x PCI-E slots22
PCI-E 16x slots22
PCI Modes16x/4x16x/4x
PCI Express5.04.0
Steel PCI-E connectors
Internal connections
TPM connector
USB 2.022
USB 3.2 gen111
USB C 3.2 gen111
ARGB LED strip3
RGB LED strip1
Video outputs
D-Sub output (VGA)
HDMI output
HDMI versionv.2.1v.2.1
DisplayPort
DisplayPort versionv.1.4v.1.4
Integrated audio
AudiochipRealtekRealtek
Sound (channels)7.17.1
Network interfaces
LAN (RJ-45)2.5 Gbps2.5 Gbps
LAN ports11
LAN controllerRealtekRealtek
External connections
USB 2.022
USB 3.2 gen111
USB 3.2 gen222
USB C 3.2 gen2x211
Power connectors
Main power socket24 pin24 pin
CPU power8 pin8 pin
Fan power connectors55
CPU Fan 4-pin11
CPU/Water Pump Fan 4-pin11
Chassis/Water Pump Fan 4-pin33
Added to E-Catalogjanuary 2023january 2022

Power phases

The number of processor power phases provided on the motherboard.

Very simplistically, phases can be described as electronic blocks of a special design, through which power is supplied to the processor. The task of such blocks is to optimize this power, in particular, to minimize power surges when the load on the processor changes. In general, the more phases, the lower the load on each of them, the more stable the power supply and the more durable the electronics of the board. And the more powerful the CPU and the more cores it has, the more phases it needs; this number increases even more if the processor is planned to be overclocked. For example, for a conventional quad-core chip, only four phases are often enough, and for an overclocked one, at least eight may be needed. It is because of this that powerful processors can have problems when used on inexpensive low-phase motherboards.

Detailed recommendations on choosing the number of phases for specific CPU series and models can be found in special sources (including the documentation for CPU itself). Here we note that with numerous phases on the motherboard (more than 8), some of them can be virtual. To do this, real electronic blocks are supplemented with doublers or even triplers, which, formally, increases the number of phases: for example, 12 claimed phases can represent 6 physical blocks with doublers. However, virtual phases are much inferior to real ones in terms of capabilities — in fact, t...hey are just additions that slightly improve the characteristics of real phases. So, let's say, in our example, it is more correct to speak not about twelve, but only about six (though improved) phases. These nuances must be specified when choosing a motherboard.

Chipset

The chipset model installed in the motherboard. AMD's current chipset models are B450, A520, B550, X570, X570S, A620, B650, B650E, X670 and X670E. For Intel, in turn, the list of chipsets looks like this: X299, H410, B460, H470, Z490, H510, B560, H570, Z590, H610, B660, H670, Z690, B760, Z790.

A chipset is a set of chips on the motherboard through which the individual components of the system interact directly: the processor, RAM, drives, audio and video adapters, network controllers, etc. Technically, such a set consists of two parts — the north and south bridges. The key element is the northbridge, it connects the processor, mem...ory, graphics card and the southbridge (together with the devices it controls). Therefore, it is often the name of the north bridge that is indicated as the chipset model, and the south bridge model is specified separately (see below); it is this scheme that is used in traditional layout motherboards, where bridges are made in the form of separate microcircuits. There are also solutions where both bridges are combined in one chip; for them, the name of the entire chipset can be indicated.

Anyway, knowing the chipset model, you can find various additional data on it — from general reviews to special instructions. An ordinary user, usually, does not need such information, but it can be useful for various professional tasks.

Interface version M.2

The version of the M.2 interface determines both the maximum data transfer rate and the supported devices that can be connected via physical M.2 connectors (see the corresponding paragraph).

The version of the M.2 interface in the specifications of motherboards is usually indicated by the number of connectors themselves and by the PCI-E revision provided for in each of them. For example, the entry “3x4.0” means three connectors capable of supporting PCI-E 4.0; and the designation “2x5.0, 1x4.0” means a trio of connectors, two of which support PCI-E 4.0, and another one supports PCI-E 5.0.

PCI Express

The version of the PCI Express interface supported by the motherboard. Recall that nowadays this interface is actually the standard for connecting video cards and other expansion cards. It can have a different number of lines — usually 1x, 4x and/or 16x; see the relevant paragraphs above for more details. Here we note that the version depends primarily on the data transfer rate per line. The most relevant options are:

PCI Express 3.0. A version released back in 2010 and implemented in hardware two years later. One of the key differences from the previous PCI E 2.0 was the use of 128b / 130b encoding, that is, in every 130 bits — 128 main and two service bits (instead of 8b / 10b, which was used earlier and gave very high redundancy). This made it possible to almost double the data transfer rate (up to 984 Mbps versus 500 Mbps per 1 PCI-E lane) with a relatively small increase in the number of transactions per second (up to 8 GT/s versus 5 GT/s). Despite the introduction of the newer version 4.0, the PCI-E 3.0 standard is still quite popular in modern motherboards.

PCI Express 4.0. Another PCI-E update introduced in 2017; the first "motherboards" with support for this version appeared in late spring 2019. Compared to PCI-E 3.0, the data transfer rate in PCI-E 4.0 has been doubled to 1969 Mbps per PCI-E lane.

PCI Express 5.0. The evoluti...onary development of the PCI Express 5.0 standard, the final specification of which was approved in 2019, and its implementation in hardware began to be implemented in 2021. If we draw parallels with PCI E 4.0, the interface bandwidth has doubled — up to 32 gigatransactions per second. In particular, PCI E 5.0 x16 devices can exchange information at a speed of about 64 GB / s.

It is worth noting that different versions of PCI-E are mutually compatible with each other, however, the throughput is limited by the slowest standard. For example, a PCI-E 4.0 graphics card installed in a PCI-E 3.0 slot will only be able to operate at half its maximum speed (according to version 3.0 specifications).

ARGB LED strip

Connector for connecting an addressable LED strip as a decorative lighting for a computer case. This type of "smart" tape is based on special LEDs, each of which consists of an LED light and a built-in controller, which allows you to flexibly control the luminosity using a special digital protocol and create amazing effects.

RGB LED strip

Connector for connecting a decorative LED strip and other devices with LED indication. Allows you to control the backlight of the case through the motherboard and customize the glow for your tasks, including synchronize it with other components.
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