Type
- Thermal paste. Thermal interface applied to the "hot" elements of the computer motherboard to provide the necessary thermal conductivity. The compositions of thermal paste contain various types of heat-conducting components in the form of nanodispersed powders and mixtures. Liquids with a low level of volatility of synthetic or mineral origin are used as a thickener for thermal paste.
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Liquid metal. Liquid metal consists of alloys with a high level of fluidity (zinc, gallium, tin, etc.). Its competitive advantage is a much higher thermal conductivity rating (7-9 times higher than that of conventional thermal paste). Also, liquid metals retain their properties in the widest temperature range from -273 °C to +1200 °C. The reverse side of the coin when using liquid metals is the complexity of applying and removing, the impossibility of using with aluminium radiators, the electrical conductivity of the material (any contact of the thermal interface with open contacts can cause a short circuit).
Weight
Product net weight (without packaging). Knowing the amount of thermal paste in the packaging, you can estimate how much it will last.
Thermal conductivity
The fundamental indicator for pasta. The parameter determines the amount of heat passing through a unit of substance during a unit of time. The higher the thermal conductivity of thermal paste, the better. For home computer processors that do not get very hot, in principle, any thermal conductivity is suitable, but for high-performance gaming stations, it is advisable to give preference to compositions with high thermal conductivity (from 5 W / mK and more).
Operating temperature
A fork of operating temperatures at which thermal paste retains its properties. Usually, the upper ceiling of the operating temperature is up to +150 °C. There are substances with a wider temperature range of properties, but they are usually used for industrial purposes. The maximum temperature value often becomes important when overclocking the processor
