Comparison Deepcool GAMMAXX S40 vs Deepcool Gamma Archer

The direction in which the active cooler (see "Type") airflow exits.

This parameter is relevant primarily for models used with processors, but the options can be as follows:

— Sideways (scattering). Operation format typical for coolers of the so-called tower design. In these models, the fan is mounted perpendicular to the substrate in contact with the processor, due to which the airflow moves parallel to the motherboard. This ensures maximum efficiency: the heated air does not return to the processor and other system components, but is dissipated in the case (and almost immediately goes outside if the computer has at least one case fan). The main disadvantage of this option is the large height of the structure, which can make it difficult to place it in some system units. However, in most cases this point is not fundamental — especially when it comes to a powerful cooling system designed for an advanced system with a performant "hot" processor. So, it is side dissipation that is the most popular option nowadays — especially in coolers with a maximum TDP of 150 W and higher (although more modest models often use this layout).

— Down (to the motherboard). This format of operation allows you to "lay" the fan with a heatsink flat on the motherboard, significantly reducing the height of the entire cooler (compared to models using side blowing). On the other hand, this format of...work is not very efficient — after all, before dissipating through the case, hot air again blows over the board with the processor. So nowadays, this option is relatively rare, and mainly in low-power coolers with an acceptable TDP of up to 150 W. And you should pay attention to such models mainly when there is little space in the case and a small cooler height is more important than high efficiency.

The maximum TDP provided by the cooling system. Note that this parameter is indicated only for solutions equipped with heatsinks (see "Type"); for separately made fans, the efficiency is determined by other parameters, primarily by the air flow values (see above).

TDP can be described as the amount of heat that a cooling system is able to remove from a serviced component. Accordingly, for the normal operation of the entire system, it is necessary that the TDP of the cooling system is not lower than the heat dissipation of this component (heat dissipation data is usually indicated in the detailed characteristics of the components). And it is best to select coolers with a power margin of at least 20 – 25% — this will give an additional guarantee in case of forced operation modes and emergency situations (including clogging of the case and reduced air exchange efficiency).

As for specific numbers, the most modest modern cooling systems provide TDP up to 100 W, the most advanced — up to 250 W and even higher.

The lowest speed at which the cooling fan is capable of operating. Specified only for models with speed control (see below).

The lower the minimum speed (with the same maximum) — the wider the speed control range and the more you can slow down the fan when high performance is not needed (such a slowdown allows you to reduce energy consumption and noise level). On the other hand, an extensive range affects the cost accordingly.

— Auto (PWM). A type of automatic regulator used in processor cooling systems. The principle of this adjustment is that the automation monitors the current load on the CPU and adjusts the fan operation mode to it. Thus, the cooling system works "in advance": it actually prevents the temperature rise, and does not eliminate it (unlike the thermostat described below). The disadvantages of such automation are the high cost and additional compatibility requirements: the PWM function must be supported by the motherboard, and the fan must be powered through a 4-pin connector (see "Power").

— Manual. Manual regulator that allows you to set the rotation speed at the request of the user. Its main advantages are both the possibility of arbitrary adjustment and reliability: automation does not always respond optimally, and in performant systems it is sometimes better for the user to take control into his own hands. On the other hand, manual control is more expensive and also more difficult to use — it requires the user to pay more attention to the state of the system, and if not attentive, the likelihood of overheating increases significantly.

— Manual / auto. A combination of the two systems described above: the main control is carried out by PWM, and the manual regulator serves to limit the maximum rotational speed. A fairly convenient and advanced option that expands the possibilities of auto-adjustment and at the same time doe...s not require constant temperature control, as with a purely manual setting. However such functionality is expensive.

— Adapter (resistor). In this case, the speed is adjusted by reducing the voltage supplied to the fan. To do this, it is connected to the power supply through a resistor adapter. This is a kind of alternative to manual adjustment: adapters are inexpensive. On the other hand, they are much less convenient: the only way to change the rotation speed with such an adjustment is to actually change the adapter, and for this you have to turn off the system and climb into the case.

— Thermostat. Automatic speed control according to data from a sensor that measures the temperature of the cooled component: when the temperature rises, the intensity of work also increases, and vice versa. Such systems are simpler than the PWMs described above, moreover, they can be used for almost any system component, not only for CPU. On the other hand, they have more inertia and reaction time: if the PWM prevents heating in advance, then the thermostat is triggered by an increase in temperature that has already happened.

The maximum airflow that a cooling fan can create; measured in CFM — cubic feet per minute.

The higher the CFM number, the more efficient the fan. On the other hand, high performance requires either a large diameter (which affects the size and cost) or high speed (which increases the noise and vibration levels). Therefore, when choosing, it makes sense not to chase the maximum air flow, but to use special formulas that allow you to calculate the required number of CFM depending on the type and power of the cooled component and other parameters. Such formulas can be found in special sources. As for specific numbers, in the most modest systems, the performance does not exceed 30 CFM, and in the most powerful systems it can be up to 80 CFM and even more.

It is also worth considering that the actual value of the air flow at the highest speed is usually lower than the claimed maximum; see Static Pressure for details.

The lowest noise level produced by the cooling system during operation.

This parameter is indicated only for those models that have capacity control and can operate at reduced power. Accordingly, the minimum noise level is the noise level in the most “quiet” mode, the volume of work, which this model cannot be less than.

These data will be useful, first of all, to those who are trying to reduce the noise level as much as possible and, as they say, “fight for every decibel”. However, it is worth noting here that in many models the minimum values are about 15 dB, and in the quietest — only 10 – 11 dB. This volume is comparable to the rustling of leaves and is practically lost against the background of ambient noise even in a residential area at night, not to mention louder conditions, and the difference between 11 and 18 dB in this case is not significant for human perception. A comparison table for sound starting from 20 dB is given in the "Noise level" section below.

The standard noise level generated by the cooling system during operation. Usually, this paragraph indicates the maximum noise during normal operation, without overloads and other "extreme".

Note that the noise level is indicated in decibels, and this is a non-linear value. So it is easiest to evaluate the actual loudness using comparative tables. Here is a table for values found in modern cooling systems:

20 dB — barely audible sound (quiet whisper of a person at a distance of about 1 m, sound background in an open field outside the city in calm weather);
25 dB — very quiet (normal whisper at a distance of 1 m);
30 dB — quiet (wall clock). It is this noise that, according to sanitary standards, is the maximum allowable for constant sound sources at night (from 23.00 to 07.00). This means that if the computer is planned to sit at night, it is desirable that the volume of the cooling system does not exceed this value.
35 dB — conversation in an undertone, sound background in a quiet library;
40 dB — conversation, relatively quiet, but already in full voice. The maximum permissible noise level for residential premises in the daytime, from 7.00 to 23.00, according to sanitary standards. However, even the noisiest cooling systems usually do not reach this indicator, the maximum for such equipment is about 38 – 39 dB.

Type of power connector for the cooling system. Power is usually output through the motherboard, for this the following connectors are most often used:

— 3-pin. Three-pin connector; Today it is considered obsolete, but it is still widely used.

— 4-pin. Plug with 4 pins. Its main advantage is the ability to automatically adjust the rotation speed via PWM (for more details, see "Speed controller").

These two standards are mutually compatible: a 3-pin fan can be connected to a 4-pin connector on the motherboard, and vice versa (unless PWM is available in both cases).

Much less common are options such as 2-pin, installed in some inexpensive fans; 6-pin, used in cooling systems with RGB backlighting, which requires a rather powerful additional power supply; 7-pin and 8-pin, similar in their specifics to a 6-pin connector; as well as power supply via a standard MOLEX plug provided in separate case fans.

Number of heat pipes in the cooling system

The heat pipe is a hermetically sealed structure containing a low-boiling liquid. When one end of the tube is heated, this liquid evaporates and condenses at the other end, thus removing heat from the heating source and transferring it to the cooler. Nowadays, such devices are widely used mainly in processor cooling systems (see "Intended use") — they connect the substrate that is in direct contact with the CPU and the heatsink of the active cooler. Manufacturers select the number of tubes based on the overall performance of the cooler (see "Maximum TDP"); however, models with similar TDPs can still differ markedly in this parameter. In such cases, it is worth considering the following: increasing the number of heat pipes increases the efficiency of heat transfer, but also increases the dimensions, weight and cost of the entire structure.

As for the number, the simplest models provide 1 – 2 heat pipes, and in the most advanced and powerful processor systems, this number can be 7 or more.