Comparison Deepcool LUCIFER K2 vs Deepcool Gabriel

— Auto (PWM). A type of automatic regulator used in processor cooling systems. The principle of this adjustment is that the automation monitors the current load on the CPU and adjusts the fan operation mode to it. Thus, the cooling system works "in advance": it actually prevents the temperature rise, and does not eliminate it (unlike the thermostat described below). The disadvantages of such automation are the high cost and additional compatibility requirements: the PWM function must be supported by the motherboard, and the fan must be powered through a 4-pin connector (see "Power").

— Manual. Manual regulator that allows you to set the rotation speed at the request of the user. Its main advantages are both the possibility of arbitrary adjustment and reliability: automation does not always respond optimally, and in performant systems it is sometimes better for the user to take control into his own hands. On the other hand, manual control is more expensive and also more difficult to use — it requires the user to pay more attention to the state of the system, and if not attentive, the likelihood of overheating increases significantly.

— Manual / auto. A combination of the two systems described above: the main control is carried out by PWM, and the manual regulator serves to limit the maximum rotational speed. A fairly convenient and advanced option that expands the possibilities of auto-adjustment and at the same time doe...s not require constant temperature control, as with a purely manual setting. However such functionality is expensive.

— Adapter (resistor). In this case, the speed is adjusted by reducing the voltage supplied to the fan. To do this, it is connected to the power supply through a resistor adapter. This is a kind of alternative to manual adjustment: adapters are inexpensive. On the other hand, they are much less convenient: the only way to change the rotation speed with such an adjustment is to actually change the adapter, and for this you have to turn off the system and climb into the case.

— Thermostat. Automatic speed control according to data from a sensor that measures the temperature of the cooled component: when the temperature rises, the intensity of work also increases, and vice versa. Such systems are simpler than the PWMs described above, moreover, they can be used for almost any system component, not only for CPU. On the other hand, they have more inertia and reaction time: if the PWM prevents heating in advance, then the thermostat is triggered by an increase in temperature that has already happened.

The maximum TDP provided by the cooling system. Note that this parameter is indicated only for solutions equipped with heatsinks (see "Type"); for separately made fans, the efficiency is determined by other parameters, primarily by the air flow values (see above).

TDP can be described as the amount of heat that a cooling system is able to remove from a serviced component. Accordingly, for the normal operation of the entire system, it is necessary that the TDP of the cooling system is not lower than the heat dissipation of this component (heat dissipation data is usually indicated in the detailed characteristics of the components). And it is best to select coolers with a power margin of at least 20 – 25% — this will give an additional guarantee in case of forced operation modes and emergency situations (including clogging of the case and reduced air exchange efficiency).

As for specific numbers, the most modest modern cooling systems provide TDP up to 100 W, the most advanced — up to 250 W and even higher.

The direction in which the active cooler (see "Type") airflow exits.

This parameter is relevant primarily for models used with processors, but the options can be as follows:

— Sideways (scattering). Operation format typical for coolers of the so-called tower design. In these models, the fan is mounted perpendicular to the substrate in contact with the processor, due to which the airflow moves parallel to the motherboard. This ensures maximum efficiency: the heated air does not return to the processor and other system components, but is dissipated in the case (and almost immediately goes outside if the computer has at least one case fan). The main disadvantage of this option is the large height of the structure, which can make it difficult to place it in some system units. However, in most cases this point is not fundamental — especially when it comes to a powerful cooling system designed for an advanced system with a performant "hot" processor. So, it is side dissipation that is the most popular option nowadays — especially in coolers with a maximum TDP of 150 W and higher (although more modest models often use this layout).

— Down (to the motherboard). This format of operation allows you to "lay" the fan with a heatsink flat on the motherboard, significantly reducing the height of the entire cooler (compared to models using side blowing). On the other hand, this format of...work is not very efficient — after all, before dissipating through the case, hot air again blows over the board with the processor. So nowadays, this option is relatively rare, and mainly in low-power coolers with an acceptable TDP of up to 150 W. And you should pay attention to such models mainly when there is little space in the case and a small cooler height is more important than high efficiency.

The ability to replace a regular fan by the user himself — without contacting a service centre or repairmen. The maximum that may be required for such a procedure is the simplest tools like a screwdriver; sometimes they are even initially included in the cooling system kit.

The fan, as the most mobile part of any cooling system, is more prone to breakdowns and failures than other parts. In cases like this, it's cheaper (and often smarter) to replace just that part rather than buying a whole new system. Also, if desired, you can change a working fan — for example, to a more powerful or less noisy one.

Number of heat pipes in the cooling system

The heat pipe is a hermetically sealed structure containing a low-boiling liquid. When one end of the tube is heated, this liquid evaporates and condenses at the other end, thus removing heat from the heating source and transferring it to the cooler. Nowadays, such devices are widely used mainly in processor cooling systems (see "Intended use") — they connect the substrate that is in direct contact with the CPU and the heatsink of the active cooler. Manufacturers select the number of tubes based on the overall performance of the cooler (see "Maximum TDP"); however, models with similar TDPs can still differ markedly in this parameter. In such cases, it is worth considering the following: increasing the number of heat pipes increases the efficiency of heat transfer, but also increases the dimensions, weight and cost of the entire structure.

As for the number, the simplest models provide 1 – 2 heat pipes, and in the most advanced and powerful processor systems, this number can be 7 or more.

The material from which the substrate of the cooling system is made is the surface that is in direct contact with the cooled component (most often the processor). This parameter is especially important for models with heat pipes (see above), although it can be specified for coolers without this function. Options can be as follows: aluminium, nickel-plated aluminium, copper, nickel-plated stranded. More about them.

— Aluminium. The traditional, most common backing material. At a relatively low cost, aluminium has good thermal conductivity characteristics, is easy to grind (required for a snug fit), and well resists scratches and other irregularities, as well as corrosion. However in terms of heat removal efficiency, this material is still inferior to copper — however, this becomes noticeable mainly in advanced systems that require the highest possible thermal conductivity.

— Copper. Copper is noticeably more expensive than aluminium, but this is offset by higher thermal conductivity and, accordingly, cooling efficiency. The noticeable disadvantages of this metal include some tendency to corrosion when exposed to moisture and certain substances. Therefore, pure copper is used relatively rarely — nickel-plated substrates are more common (see below).

— Nickel-plated copper. Copper substrate with an additional n...ickel coating. Such a coating increases resistance to corrosion and scratches, while it practically does not affect the thermal conductivity of the substrate and work efficiency. However this feature somewhat increases the price of the radiator, but it is found mainly in high-end cooling systems, where this moment is almost invisible against the background of the overall cost of the device.

— Nickel-plated aluminium. Aluminium substrate with an additional nickel coating. For aluminium in general, see above, and the coating makes the heatsink more resistant to corrosion, scratches, and burrs. On the other hand, it affects the cost, despite the fact that in fact, pure aluminium is often quite sufficient for efficient operation (especially since this metal itself is very resistant to corrosion). Therefore, this variant was not distributed.

Socket type - socket for CPU - with which the corresponding cooling system is compatible.

Different sockets differ not only in compatibility with a particular CPU, but also in the configuration of the seat for the cooling system. So, when purchasing a processor cooling system separately, you should make sure that it is compatible with the socket. Nowadays, solutions are produced mainly for the following types of sockets: AMD AM2/AM3/FM1/FM2, AMD AM4, AMD AM5, AMD TR4/TRX4, Intel 775, Intel 1150, Intel 1155/1156, Intel 1366, Intel 2011/2011 v3, Intel 2066, Intel 1151/1151 v2, Intel 1200, Intel 1700.

General dimensions of the cooling system. For water systems (see "Type"), this paragraph indicates the size of the external radiator (the dimensions of the water block in such devices are small, and there is no need to specify them in particular).

In general, this is a fairly obvious parameter. We only note that for case fans (see ibid.), the thickness is of particular importance — it directly depends on how much space the device will take up inside the system unit. At the same time, it is customary to refer to fans with a thin case for models in which this size does not exceed 20 mm.

The cooling system should fit into the computer case without any problems. The vast majority of case manufacturers indicate in the specifications the maximum height of the cooler that can be installed on their chassis. It is from this value that it is necessary to build on when choosing a cooling system. With an oversized cooler, you will have to leave the side wall of the case wide open, which violates the built-in air circulation pattern and provokes dust pollution of the internal space of the system unit.