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Comparison Asus TUF B450M-PRO GAMING vs Gigabyte B450 AORUS M

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Asus TUF B450M-PRO GAMING
Gigabyte B450 AORUS M
Asus TUF B450M-PRO GAMINGGigabyte B450 AORUS M
from £154.34 
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from £49.30 
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Main
Advanced overclocking capabilities. Reinforced power subsystem and VRM heatsink. XMP support for overclocking RAM. M.2 slot with heatsink and NVMe support. LAN controller with traffic prioritization. Sound system with improved analogue path.
Featuresgaming for overclockinggaming for overclocking
SocketAMD AM4AMD AM4
Form factormicro-ATXmicro-ATX
Power phases1011
VRM heatsink
LED lighting
Lighting syncAsus Aura SyncGigabyte RGB Fusion
Size (HxW)244x244 mm244x244 mm
Chipset
ChipsetAMD B450AMD B450
BIOSAmiAmi
DualBIOS
UEFI BIOS
RAM
DDR44 slot(s)4 slot(s)
Memory moduleDIMMDIMM
Operation mode2 channel2 channel
Max. clock frequency3533 MHz3600 MHz
Max. memory64 GB64 GB
XMP
ECC
Drive interface
SATA 3 (6Gbps)66
M.2 connector21
M.21xSATA/PCI-E 4x, 1xSATA/PCI-E 2x1xSATA/PCI-E 4x
M.2 SSD cooling
Integrated RAID controller
 /Raid 0, 1, 10/
 /RAID 0, RAID 1, RAID 10/
Expansion slots
1x PCI-E slots11
PCI-E 16x slots22
PCI Modes16x/4x16x/4x
PCI Express3.03.0
CrossFire (AMD)
Steel PCI-E connectors
Internal connections
TPM connector
USB 2.022
USB 3.2 gen111
RGB LED strip1
Video outputs
DVI outputDVI-DDVI-D
HDMI output
Integrated audio
AudiochipRealtek ALC S1200ARealtek ALC892
Sound (channels)7.17.1
Network interfaces
LAN (RJ-45)1 Gbps1 Gbps
LAN ports11
LAN controllerRealtek RTL8111HRealtek GbE
External connections
USB 2.022
USB 3.2 gen124
USB 3.2 gen212
USB C 3.2 gen21
PS/211
Power connectors
Main power socket24 pin24 pin
CPU power8 pin8 pin
Fan power connectors33
CPU Fan 4-pin1
Chassis/Water Pump Fan 4-pin2
Added to E-Catalognovember 2018july 2018

Power phases

The number of processor power phases provided on the motherboard.

Very simplistically, phases can be described as electronic blocks of a special design, through which power is supplied to the processor. The task of such blocks is to optimize this power, in particular, to minimize power surges when the load on the processor changes. In general, the more phases, the lower the load on each of them, the more stable the power supply and the more durable the electronics of the board. And the more powerful the CPU and the more cores it has, the more phases it needs; this number increases even more if the processor is planned to be overclocked. For example, for a conventional quad-core chip, only four phases are often enough, and for an overclocked one, at least eight may be needed. It is because of this that powerful processors can have problems when used on inexpensive low-phase motherboards.

Detailed recommendations on choosing the number of phases for specific CPU series and models can be found in special sources (including the documentation for CPU itself). Here we note that with numerous phases on the motherboard (more than 8), some of them can be virtual. To do this, real electronic blocks are supplemented with doublers or even triplers, which, formally, increases the number of phases: for example, 12 claimed phases can represent 6 physical blocks with doublers. However, virtual phases are much inferior to real ones in terms of capabilities — in fact, t...hey are just additions that slightly improve the characteristics of real phases. So, let's say, in our example, it is more correct to speak not about twelve, but only about six (though improved) phases. These nuances must be specified when choosing a motherboard.

Lighting sync

Synchronization technology provided in the board with LED backlight (see above).

Synchronization itself allows you to "match" the backlight of the motherboard with the backlight of other system components — cases, video cards, keyboards, mice, etc. Thanks to this matching, all components can change colour synchronously, turn on / off at the same time, etc. Specific features the operation of such backlighting depends on the synchronization technology used, and, usually, each manufacturer has its own (Mystic Light Sync for MSI, RGB Fusion for Gigabyte, etc.). The compatibility of the components also depends on this: they must all support the same technology. So the easiest way to achieve backlight compatibility is to collect components from the same manufacturer.

DualBIOS

Motherboard support for DualBIOS technology.

Crashes and errors in the BIOS (see BIOS) are one of the most serious problems that can occur with a modern PC — they not only make the computer unusable, but also very difficult to fix. DualBIOS technology is designed to make it easier to deal with such problems. Motherboards made using this technology have two chips for writing the BIOS: the first chip contains the main BIOS version, which is used to boot the system in normal mode, the second one contains a backup copy of the BIOS in the original (factory) configuration. The backup chip comes into operation if an error is detected in the main BIOS: if an error is detected in the programme code, it is restored to the original factory version, but if there was a hardware failure, the backup chip takes control of the system, replacing the main one. This allows you to keep your system up and running even in the event of serious BIOS problems without resorting to complex recovery procedures.

Max. clock frequency

The maximum RAM clock speed supported by the motherboard. The actual clock frequency of the installed RAM modules should not exceed this indicator — otherwise, malfunctions are possible, and the capabilities of the “RAM” cannot be used to the fullest.

For modern PCs, a RAM frequency of 1500 – 2000 MHz or less is considered very low, 2000 – 2500 MHz is modest, 2500 – 3000 MHz is average, 3000 – 3500 MHz is above average, and the most advanced boards can support frequencies of 3500 – 4000 MHz and even more than 4000 MHz.

XMP

The ability of the motherboard to work with RAM modules that support XMP (Extreme Memory Profiles) technology. This technology was developed by Intel; it is used in motherboards and RAM blocks and only works if both of these system components are XMP compliant. A similar technology from AMD is called AMP.

The main function of XMP is to facilitate system overclocking (“overclocking”): special overclocking profiles are “sewn” into the memory with this technology, and if desired, the user can only select one of these profiles without resorting to complex configuration procedures. This is not only easier, but also safer: every profile added to the bar is tested for stability.

ECC

The ability of the motherboard to work with memory modules that support ECC (Error Checking and Correction) technology. This technology allows you to correct minor errors that occur in the process of working with data, and increases the overall reliability of the system; mainly used in servers.

M.2 connector

The number of M.2 connectors provided in the design of the motherboard. There are motherboards for 1 M.2 connector, for 2 connectors, for 3 connectors or more.

The M.2 connector is designed to connect advanced internal devices in a miniature form factor — in particular, high-speed SSD drives, as well as expansion cards like Wi-Fi and Bluetooth modules. However, connectors designed to connect only peripherals (Key E) are not included in this number. Nowadays, this is one of the most modern and advanced ways to connect components. But note that different interfaces can be implemented through this connector — SATA or PCI-E, and not necessarily both at once. See "M.2 interface" for details; here we note that SATA has a low speed and is used mainly for low-cost drives, while PCI-E is used for advanced solid-state modules and is also suitable for other types of internal peripherals.

Accordingly, the number of M.2 is the number of components of this format that can be simultaneously connected to the motherboard. At the same time, many modern boards, especially mid-range and top-end ones, are equipped with two or more M.2 connectors, and moreover, with PCI-E support.

M.2

Electrical (logical) interfaces implemented through physical M.2 connectors on the motherboard.

See above for more details on such connectors. Here we note that they can work with two types of interfaces:
  • SATA is a standard originally created for hard drives. M.2 usually supports the newest version, SATA 3; however, even it is noticeably inferior to PCI-E in terms of speed (600 MB / s) and functionality (only drives);
  • PCI-E is the most common modern interface for connecting internal peripherals (otherwise NVMe). Suitable for both expansion cards (such as wireless adapters) and drives, while PCI-E speeds allow you to fully realize the potential of modern SSDs. The maximum communication speed depends on the version of this interface and on the number of lines. In modern M.2 connectors, you can find PCI-E versions 3.0 and 4.0, with speeds of about 1 GB / s and 2 GB / s per lane, respectively; and the number of lanes can be 1, 2 or 4 (PCI-E 1x, 2x and 4x respectively)
Specifically, the M.2 interface in the characteristics of motherboards is indicated by the number of connectors themselves and by the type of interfaces provided for in each of them. For example, the entry "3xSATA / PCI-E 4x" means three connectors that can work both in SATA format and in PCI-E 4x format; and the designation "1xSATA / PCI-E 4x, 1xPCI-E 2x" means two connectors, one of which works as SATA or PCI-E 4x, and the second — only as PCI-E 2x.

M.2 SSD cooling

Motherboard-integrated cooling for M.2 SSD drives.

This connector allows you to achieve high speed, however, for the same reason, many M.2 SSDs have high heat dissipation, and additional cooling may be required to avoid overheating. Most often, the simplest radiator in the form of a metal plate is responsible for such cooling — in the case of an SSD, this is quite enough.
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