United Kingdom
Catalog   /   Computing   /   Components   /   Computer Cooling

Comparison ARCTIC Freezer 33 eSports ONE vs ARCTIC Freezer 33 eSports Edition

Add to comparison
ARCTIC Freezer 33 eSports ONE
ARCTIC Freezer 33 eSports Edition
ARCTIC Freezer 33 eSports ONEARCTIC Freezer 33 eSports Edition
Outdated Product
from £51.18 
Expecting restock
TOP sellers
Main specs
Featuresfor CPUfor CPU
Product typeair coolerair cooler
Fan
Number of fans12
Fan size120 mm120 mm
Bearinghydrodynamichydrodynamic
Max. RPM1800 rpm1800 rpm
Speed controllerauto (PWM)auto (PWM)
Max. air flow69 CFM138 CFM
Max. TDP200 W210 W
Air flow directionsideways (dispersion)
replaceable
Radiator
Heat pipes44
Heatsink materialaluminium/copperaluminium/copper
Socket
AMD AM4
Intel 1150
Intel 1155/1156
Intel 2011 / 2011 v3
Intel 2066
Intel 1151 / 1151 v2
Intel 1200
AMD AM4
Intel 1150
Intel 1155/1156
Intel 2011 / 2011 v3
Intel 2066
Intel 1151 / 1151 v2
Intel 1200
General
Power source4-pin4-pin
Mount typebilateral (backplate)bilateral (backplate)
Dimensions123x88x150 mm123x120x150 mm
Height150 mm150 mm
Weight676 g805 g
Added to E-Catalogjanuary 2018january 2018

Number of fans

The number of fans in the design of the cooling system. More fans provide higher efficiency (all else being equal); on the other hand, the dimensions and the noise generated during operation also increase accordingly. Also, note that other things being equal, a smaller number of large fans is considered more advanced than numerous small ones; see "Fan diameter" for details.

Max. air flow

The maximum airflow that a cooling fan can create; measured in CFM — cubic feet per minute.

The higher the CFM number, the more efficient the fan. On the other hand, high performance requires either a large diameter (which affects the size and cost) or high speed (which increases the noise and vibration levels). Therefore, when choosing, it makes sense not to chase the maximum air flow, but to use special formulas that allow you to calculate the required number of CFM depending on the type and power of the cooled component and other parameters. Such formulas can be found in special sources. As for specific numbers, in the most modest systems, the performance does not exceed 30 CFM, and in the most powerful systems it can be up to 80 CFM and even more.

It is also worth considering that the actual value of the air flow at the highest speed is usually lower than the claimed maximum; see Static Pressure for details.

Max. TDP

The maximum TDP provided by the cooling system. Note that this parameter is indicated only for solutions equipped with heatsinks (see "Type"); for separately made fans, the efficiency is determined by other parameters, primarily by the air flow values (see above).

TDP can be described as the amount of heat that a cooling system is able to remove from a serviced component. Accordingly, for the normal operation of the entire system, it is necessary that the TDP of the cooling system is not lower than the heat dissipation of this component (heat dissipation data is usually indicated in the detailed characteristics of the components). And it is best to select coolers with a power margin of at least 20 – 25% — this will give an additional guarantee in case of forced operation modes and emergency situations (including clogging of the case and reduced air exchange efficiency).

As for specific numbers, the most modest modern cooling systems provide TDP up to 100 W, the most advanced — up to 250 W and even higher.

Air flow direction

The direction in which the active cooler (see "Type") airflow exits.

This parameter is relevant primarily for models used with processors, but the options can be as follows:

Sideways (scattering). Operation format typical for coolers of the so-called tower design. In these models, the fan is mounted perpendicular to the substrate in contact with the processor, due to which the airflow moves parallel to the motherboard. This ensures maximum efficiency: the heated air does not return to the processor and other system components, but is dissipated in the case (and almost immediately goes outside if the computer has at least one case fan). The main disadvantage of this option is the large height of the structure, which can make it difficult to place it in some system units. However, in most cases this point is not fundamental — especially when it comes to a powerful cooling system designed for an advanced system with a performant "hot" processor. So, it is side dissipation that is the most popular option nowadays — especially in coolers with a maximum TDP of 150 W and higher (although more modest models often use this layout).

Down (to the motherboard). This format of operation allows you to "lay" the fan with a heatsink flat on the motherboard, significantly reducing the height of the entire cooler (compared to models using side blowing). On the other hand, this format of...work is not very efficient — after all, before dissipating through the case, hot air again blows over the board with the processor. So nowadays, this option is relatively rare, and mainly in low-power coolers with an acceptable TDP of up to 150 W. And you should pay attention to such models mainly when there is little space in the case and a small cooler height is more important than high efficiency.

Dimensions

General dimensions of the cooling system. For water systems (see "Type"), this paragraph indicates the size of the external radiator (the dimensions of the water block in such devices are small, and there is no need to specify them in particular).

In general, this is a fairly obvious parameter. We only note that for case fans (see ibid.), the thickness is of particular importance — it directly depends on how much space the device will take up inside the system unit. At the same time, it is customary to refer to fans with a thin case for models in which this size does not exceed 20 mm.
ARCTIC Freezer 33 eSports ONE often compared
ARCTIC Freezer 33 eSports Edition often compared