Max. TDP
The maximum TDP provided by the cooling system. Note that this parameter is indicated only for solutions equipped with heatsinks (see "Type"); for separately made fans, the efficiency is determined by other parameters, primarily by the air flow values (see above).
TDP can be described as the amount of heat that a cooling system is able to remove from a serviced component. Accordingly, for the normal operation of the entire system, it is necessary that the TDP of the cooling system is not lower than the heat dissipation of this component (heat dissipation data is usually indicated in the detailed characteristics of the components). And it is best to select coolers with a power margin of at least 20 – 25% — this will give an additional guarantee in case of forced operation modes and emergency situations (including clogging of the case and reduced air exchange efficiency).
As for specific numbers, the most modest modern cooling systems provide TDP
up to 100 W, the most advanced —
up to 250 W and even
higher.
Heat pipes
Number of heat pipes in the cooling system
The heat pipe is a hermetically sealed structure containing a low-boiling liquid. When one end of the tube is heated, this liquid evaporates and condenses at the other end, thus removing heat from the heating source and transferring it to the cooler. Nowadays, such devices are widely used mainly in processor cooling systems (see "Intended use") — they connect the substrate that is in direct contact with the CPU and the heatsink of the active cooler. Manufacturers select the number of tubes based on the overall performance of the cooler (see "Maximum TDP"); however, models with similar TDPs can still differ markedly in this parameter. In such cases, it is worth considering the following: increasing the number of heat pipes increases the efficiency of heat transfer, but also increases the dimensions, weight and cost of the entire structure.
As for the number, the simplest models provide
1 – 2 heat pipes, and in the most advanced and powerful processor systems, this number can be
7 or more.
Mount type
—
Latches. The simplest and most convenient type of fastening, in particular due to the fact that it does not require the use of additional tools. Plus, you don't need to remove the motherboard for snap-on installation.
— Double-
sided (backplate). This type of fastening is used in the most powerful and, as a result, heavy and large-sized cooling systems. Its feature is the presence of a plate installed on the opposite side of the motherboard — this plate is designed to protect against damage and so that the board does not bend under the weight of the structure.
—
Bolts. Fastening with classic bolts. It is considered somewhat more reliable than latches (see above), but less convenient, because. You can remove and install the cooling system only with a screwdriver. To date, bolts are mainly used to fasten case fans, as well as cooling systems for RAM and hard drives (see "Type", "Purpose").
—
Silicone mounts. The main advantage of silicone fasteners is good vibration absorption, which significantly reduces the noise level compared to similar systems using other types of fasteners. On the other hand, silicone is somewhat less reliable than bolts, so both types of fasteners are usually supplied in the kit, and the user chooses which ones to use.
— Adhesive tape. Fastening with adhesive tape (adhesi
...ve tape), usually double-sided. The main advantages of this mount are ease of use and compactness. On the other hand, it is difficult to remove such a cooling system. In addition, adhesive tape is inferior in thermal conductivity to the same thermal paste.