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Comparison PCCooler GI-H58UB CORONA vs PCCooler GI-X6B

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PCCooler GI-H58UB CORONA
PCCooler GI-X6B
PCCooler GI-H58UB CORONAPCCooler GI-X6B
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Main specs
Featuresfor CPUfor CPU
Product typeair coolerair cooler
Air flow directionsideways (dispersion)sideways (dispersion)
Max. TDP240 W160 W
Fan
Number of fans11
Fan size120 mm120 mm
Bearinghydrodynamichydrodynamic
Min. RPM1000 rpm1000 rpm
Max. RPM1800 rpm1800 rpm
Speed controllerauto (PWM)auto (PWM)
Max. air flow65 CFM
MTBF30 K hours
replaceable
Min noise level8 dB18 dB
Noise level27 dB26 dB
Power source4-pin4-pin
Radiator
Heat pipes55
Heatpipe contactstraight
Heatsink materialaluminium / copperaluminium / copper
Plate materialaluminium
Socket
AMD AM2/AM3/FM1/FM2
AMD AM4
Intel 775
Intel 1150
Intel 1155/1156
Intel 1366
Intel 2011 / 2011 v3
Intel 2066
Intel 1151 / 1151 v2
Intel 1200
AMD AM2/AM3/FM1/FM2
AMD AM4
Intel 775
Intel 1150
Intel 1155/1156
 
 
 
Intel 1151 / 1151 v2
Intel 1200
General
Lighting
Mount typelatchesbilateral (backplate)
Dimensions134х100х152 mm
Height152 mm148 mm
Weight810 g
Added to E-Catalogmay 2019august 2018

Max. TDP

The maximum TDP provided by the cooling system. Note that this parameter is indicated only for solutions equipped with heatsinks (see "Type"); for separately made fans, the efficiency is determined by other parameters, primarily by the air flow values (see above).

TDP can be described as the amount of heat that a cooling system is able to remove from a serviced component. Accordingly, for the normal operation of the entire system, it is necessary that the TDP of the cooling system is not lower than the heat dissipation of this component (heat dissipation data is usually indicated in the detailed characteristics of the components). And it is best to select coolers with a power margin of at least 20 – 25% — this will give an additional guarantee in case of forced operation modes and emergency situations (including clogging of the case and reduced air exchange efficiency).

As for specific numbers, the most modest modern cooling systems provide TDP up to 100 W, the most advanced — up to 250 W and even higher.

Max. air flow

The maximum airflow that a cooling fan can create; measured in CFM — cubic feet per minute.

The higher the CFM number, the more efficient the fan. On the other hand, high performance requires either a large diameter (which affects the size and cost) or high speed (which increases the noise and vibration levels). Therefore, when choosing, it makes sense not to chase the maximum air flow, but to use special formulas that allow you to calculate the required number of CFM depending on the type and power of the cooled component and other parameters. Such formulas can be found in special sources. As for specific numbers, in the most modest systems, the performance does not exceed 30 CFM, and in the most powerful systems it can be up to 80 CFM and even more.

It is also worth considering that the actual value of the air flow at the highest speed is usually lower than the claimed maximum; see Static Pressure for details.

MTBF

The total time that a cooling fan is guaranteed to run before it fails. Note that when this time is exhausted, the device will not necessarily break — many modern fans have a significant margin of safety and are able to work for some more period. At the same time, it is worth evaluating the overall durability of the cooling system according to this parameter.

Min noise level

The lowest noise level produced by the cooling system during operation.

This parameter is indicated only for those models that have capacity control and can operate at reduced power. Accordingly, the minimum noise level is the noise level in the most “quiet” mode, the volume of work, which this model cannot be less than.

These data will be useful, first of all, to those who are trying to reduce the noise level as much as possible and, as they say, “fight for every decibel”. However, it is worth noting here that in many models the minimum values are about 15 dB, and in the quietest — only 10 – 11 dB. This volume is comparable to the rustling of leaves and is practically lost against the background of ambient noise even in a residential area at night, not to mention louder conditions, and the difference between 11 and 18 dB in this case is not significant for human perception. A comparison table for sound starting from 20 dB is given in the "Noise level" section below.

Noise level

The standard noise level generated by the cooling system during operation. Usually, this paragraph indicates the maximum noise during normal operation, without overloads and other "extreme".

Note that the noise level is indicated in decibels, and this is a non-linear value. So it is easiest to evaluate the actual loudness using comparative tables. Here is a table for values found in modern cooling systems:

20 dB — barely audible sound (quiet whisper of a person at a distance of about 1 m, sound background in an open field outside the city in calm weather);
25 dB — very quiet (normal whisper at a distance of 1 m);
30 dB — quiet (wall clock). It is this noise that, according to sanitary standards, is the maximum allowable for constant sound sources at night (from 23.00 to 07.00). This means that if the computer is planned to sit at night, it is desirable that the volume of the cooling system does not exceed this value.
35 dB — conversation in an undertone, sound background in a quiet library;
40 dB — conversation, relatively quiet, but already in full voice. The maximum permissible noise level for residential premises in the daytime, from 7.00 to 23.00, according to sanitary standards. However, even the noisiest cooling systems usually do not reach this indicator, the maximum for such equipment is about 38 – 39 dB.

Heatpipe contact

The type of contact between the heat pipes provided in the heatsink of the cooling system and the cooled components (usually the CPU). For more information about heat pipes, see above, and the types of contact can be as follows:

Indirect. The classic version of the design: heat pipes pass through a metal (usually aluminium) base, which is directly adjacent to the surface of the chip. The advantage of such contact is the most even distribution of heat between the tubes, regardless of the physical size of the chip itself (the main thing is that it should not be larger than the sole). At the same time, the extra piece between the processor and the tubes inevitably increases thermal resistance and slightly reduces the overall cooling efficiency. In many systems, especially high-end ones, this drawback is compensated by various design solutions (primarily by the tightest connection of the tubes with the sole), but this, in turn, affects the cost.

Direct. With direct contact, the heat pipes fit directly on the cooled chip, without an additional sole; for this, the surface of the tubes on the desired side is ground down to a plane. Due to the absence of intermediate parts, the thermal resistance at the places where the tubes fit is minimal, and at the same time, the radiator design itself is simpler and cheaper than with indirect contact. On the other hand, there are gaps between the heat...pipes, sometimes very large — as a result, the surface of the serviced chip is cooled unevenly. This is partly offset by the presence of a substrate (in this case, it fills these gaps) and the use of thermal paste, however, in terms of uniformity of heat removal, direct contact is still inevitably inferior to indirect contact. Therefore, this option is found mainly in inexpensive coolers, although it can also be used in fairly performant solutions.

Plate material

The material from which the substrate of the cooling system is made is the surface that is in direct contact with the cooled component (most often the processor). This parameter is especially important for models with heat pipes (see above), although it can be specified for coolers without this function. Options can be as follows: aluminium, nickel-plated aluminium, copper, nickel-plated stranded. More about them.

— Aluminium. The traditional, most common backing material. At a relatively low cost, aluminium has good thermal conductivity characteristics, is easy to grind (required for a snug fit), and well resists scratches and other irregularities, as well as corrosion. However in terms of heat removal efficiency, this material is still inferior to copper — however, this becomes noticeable mainly in advanced systems that require the highest possible thermal conductivity.

— Copper. Copper is noticeably more expensive than aluminium, but this is offset by higher thermal conductivity and, accordingly, cooling efficiency. The noticeable disadvantages of this metal include some tendency to corrosion when exposed to moisture and certain substances. Therefore, pure copper is used relatively rarely — nickel-plated substrates are more common (see below).

— Nickel-plated copper. Copper substrate with an additional n...ickel coating. Such a coating increases resistance to corrosion and scratches, while it practically does not affect the thermal conductivity of the substrate and work efficiency. However this feature somewhat increases the price of the radiator, but it is found mainly in high-end cooling systems, where this moment is almost invisible against the background of the overall cost of the device.

— Nickel-plated aluminium. Aluminium substrate with an additional nickel coating. For aluminium in general, see above, and the coating makes the heatsink more resistant to corrosion, scratches, and burrs. On the other hand, it affects the cost, despite the fact that in fact, pure aluminium is often quite sufficient for efficient operation (especially since this metal itself is very resistant to corrosion). Therefore, this variant was not distributed.

Socket

Socket - processor connector - with which the corresponding cooling system is compatible.

Different sockets differ not only in compatibility with a particular CPU, but also in the configuration of the mounting place for the cooling system. So, when purchasing a processor cooling system separately, it is worth making sure that it is compatible with the socket. Nowadays, solutions are mainly produced for the following types of sockets: AMD AM2/AM3/FM1/FM2, AMD AM4, AMD AM5, AMD TR4/TRX4, Intel 775, Intel 1150, Intel 1155/1156, Intel 1366, Intel 2011/2011 v3, Intel 2066, Intel 1151/1151 v2, Intel 1200, Intel 1700.

Mount type

Latches. The simplest and most convenient type of fastening, in particular due to the fact that it does not require the use of additional tools. Plus, you don't need to remove the motherboard for snap-on installation.

— Double- sided (backplate). This type of fastening is used in the most powerful and, as a result, heavy and large-sized cooling systems. Its feature is the presence of a plate installed on the opposite side of the motherboard — this plate is designed to protect against damage and so that the board does not bend under the weight of the structure.

Bolts. Fastening with classic bolts. It is considered somewhat more reliable than latches (see above), but less convenient, because. You can remove and install the cooling system only with a screwdriver. To date, bolts are mainly used to fasten case fans, as well as cooling systems for RAM and hard drives (see "Type", "Purpose").

Silicone mounts. The main advantage of silicone fasteners is good vibration absorption, which significantly reduces the noise level compared to similar systems using other types of fasteners. On the other hand, silicone is somewhat less reliable than bolts, so both types of fasteners are usually supplied in the kit, and the user chooses which ones to use.

— Adhesive tape. Fastening with adhesive tape (adhesi...ve tape), usually double-sided. The main advantages of this mount are ease of use and compactness. On the other hand, it is difficult to remove such a cooling system. In addition, adhesive tape is inferior in thermal conductivity to the same thermal paste.
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