BGA Solder Reballing Balls Soldering Rework Repair Tools
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Buy BGA Solder Reballing Balls Soldering Rework Repair Tools
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BGA Solder Reballing Balls Soldering Rework Repair Tools | £2.63 | ||||
Features: Ecofriendly, bright and full solder joint, little smoke, no irritating smell. Strong welding force, widely used in all kinds of electronic products. Easy to weld, no false welding. 25000pcsbottle for enough use. Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultrasmall ball type tin electronic parts. Specification: Material: tin Solder flux content: 63percent Tin ball diameter: 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm (Optional) Melting point: 183 celsius Operating temperature: 200~380 celsius Bottle size: 35mm 1.4in (high ); 16mm 0.6in (width) Quantity: 25000pcsbottle
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