BGA Solder Reballing Balls Soldering Rework Repair Tools

Features: Ecofriendly, bright and full solder joint, little smoke, no irritating smell. Strong welding force, widely used in all kinds of electronic products. Easy to weld, no false welding. 25000pcsbottle for enough use. Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultrasmall ball type tin electronic parts. Specification: Material: tin Solder flux content: 63percent Tin ball diameter: 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm (Optional) Melting point: 183 celsius Operating temperature: 200~380 celsius Bottle size: 35mm 1.4in (high ); 16mm 0.6in (width) Quantity: 25000pcsbottle Package List: 1Bottle x Soldering Ball Note: There are 25,000 piecesbottle. The bottle size is fixed. The larger the Diameter of the ball, the greater its load. .Eco?friendly, bright and full solder joint, little smoke, no irritating smell. Strong welding force, widely used in all kinds of electronic products. Easy to weld, no false welding. 25000pcsbottle for enough use. Available in various sizes, 0.25mm, 0.35mm, 0.45mm, 0.55mm, 0.65mm Tin ball is mainly used to connect semiconductor wafers and circuit templates and printed circuit boards, transmission electronic signals of ultrasmall ball type tin electronic parts.