Solder Balls BGA Reballing 0.45mm 250 Thousand Grains for Laptop Phone Repair

Feature: 1. Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit 2. Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic signals with ultra?small ball tin electronic parts, etc. 3. The solder with tin balls is more durable and can help you solder effectively 4. Small size, easy to carry and store, convenient to use and with good performance 5. 250 thousand grains, a large number, can meet your use and replacement needs, very practically Specification: Item Type: Solder BallsProduct Composition: Sn63(tin 63percent ) Specification: Approx.0.45mm 0.02in 250,000 grains Uses: Chip planting beads, ball planting