Low Temperature Tin Paste SMD Chip BGA Balling Tin Soldering Paste for Electronic Repair

Feature: 1. FOR BGA PLANTING: Low temperature tin paste, used for BGA tin planting when repairing electronic products such as mobile phones and computers. 2. FOR CHIP WELDING: Tin paste can also be used for home appliance chip patch welding and electronic production line welding, with good practicability. 3. EXCELLENT TIN: Using excellent tin material, tin paste is suitable for products that are not resistant to high temperature, low energy consumption. 4. HIGH PERFORMANCE: The solder joints are white and full, without false soldering, and have a strong reconciliation force with the soldering iron tip. 5. HIGH EFFICIENCY: Using this low temperature tin paste instead of artificial soldering greatly improves the welding efficiency and has good wettability. Specification: Item Type: Low Temperature Tin Paste Material: Tin. Package List: 1 x Tin Paste Note: Do not store below 0 celsius , as thawing will compromise the rheological properties of the solder paste.FOR BGA PLANTING: Low temperature tin paste, used for BGA tin planting when repairing electronic products such as mobile phones and computers. FOR CHIP WELDING: Tin paste can also be used for home appliance chip patch welding and electronic production line welding, with good practicability. EXCELLENT TIN: Using excellent tin material, tin paste is suitable for products that are not resistant to high temperature, low energy consumption. HIGH PERFORMANCE: The solder joints are white and full, without false soldering, and have a strong reconciliation force with the soldering iron tip. HIGH EFFICIENCY: Using this low temperature tin paste instead of artificial soldering greatly improves the welding efficiency and has good wettability.