Akasa T5 Pro-Grade+. Type: Thermal paste Thermal conductivity: 5.2 W/mK Product colour: Grey. Weight: 5 g. Quantity per pack
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Buy Akasa T5 Pro-Grade+. Type: Thermal paste Thermal conductivity: 5.2 W/mK Product colour: Grey. Weight: 5 g. Quantity per pack
When you make a purchase through links on our site, we may receive a affiliate commission.
| £14.25 |  | ||||
Akasa T5 Pro-Grade+. Type: Thermal paste Thermal conductivity: 5.2 W/mK Product colour: Grey. Weight: 5 g. Quantity per pack | £22.92 |  | |||
T5 Pro-Grade+
Easily apply ultra-performance hybrid thermal paste to your CPU and GPU designed for highly efficient computer setups. Perfect for overclocking enthusiasts with 10-20 applications.
- Designed with hybrid silicone and nano-diamond particles for ultra-performance
- Non-curing and non-electrically conductive properties
- Conveniently included wipes and spreader
Nano-Diamond Particles for Superior Heat Transmission
Use of hybrid silicone and nano diamond micro particles ensures minimal thermal resistance for quick and efficient heat transmission.
Getting the most out of your processor air and liquid heatsink cooler. Making it perfect for overclockers.
Easy and Safe Application
Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.
Conveniently Included Wipes and Spreader
Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.
Application
Thermally conductive compound
Thermal Conductivity
5.2 W/mK
Specific Gravity
2.6
Form
Non-curing compound
Operating Temperature
-50C to 250C
Thermal Resistance
0.04C-cm/W @ 60 psi
Colour
Grey
Viscosity
6000000 (mPa.s/ 22C)
Weight
5g
Easily apply ultra-performance hybrid thermal paste to your CPU and GPU designed for highly efficient computer setups. Perfect for overclocking enthusiasts with 10-20 applications.
- Designed with hybrid silicone and nano-diamond particles for ultra-performance
- Non-curing and non-electrically conductive properties
- Conveniently included wipes and spreader
Nano-Diamond Particles for Superior Heat Transmission
Use of hybrid silicone and nano diamond micro particles ensures minimal thermal resistance for quick and efficient heat transmission.
Getting the most out of your processor air and liquid heatsink cooler. Making it perfect for overclockers.
Easy and Safe Application
Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.
Conveniently Included Wipes and Spreader
Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.
Application
Thermally conductive compound
Thermal Conductivity
5.2 W/mK
Specific Gravity
2.6
Form
Non-curing compound
Operating Temperature
-50C to 250C
Thermal Resistance
0.04C-cm/W @ 60 psi
Colour
Grey
Viscosity
6000000 (mPa.s/ 22C)
Weight
5g
The product description is generated based on data from online stores. Before purchasing be sure to verify all information directly with the seller.
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