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Akasa Maxwell Pro Plus Fanless Mini ITX Case 65W TDP 2x 2.5" Aluminiu

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Akasa Maxwell Pro Plus Fanless Mini ITX Case 65W TDP 2x 2.5" Aluminiu
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Akasa Maxwell Pro Plus Fanless Mini ITX Case 65W TDP 2x 2.5" Aluminiu

Fanless Mini-ITX Case for Intel® LGA1700   Blending advanced passive cooling engineering and modern design to create a premium silent and compact case for Mini-ITX boards. Supports Intel® and AMD boards with common desktop processors up to 65W TDP. The perfect choice for gaming HTPCs & audiophile environments.... more    65W TDP   Perfect for the Intel® Alder Lake processors up to 65W Thermal Design Point (TDP) with increased contact surface area allowing for more heat to be dissipated at a time. Advanced Performance Bi-symmetrical extruded fins on either side of the case maximise the surface area of the exterior for increased heat dissipation. Coupled with internally hi-efficient passive thermal module and heat pipes to ensure the Thermal Design Power (TDP) is met.~ True Silent Experience Fanless CPU design eliminates the need for noisy mechanical fans so that true silence can be achieved. Paired with the use of Solid State Drives one can truly immerse themselves in the experience of soundless acoustics. Breathability provided by multi-functional apertures which optimise natural convectional airflow is fused with contemporary design for a minimalist yet functional case. Universal Socket Fitting & Easy Installation Easily adjustable thermal module with 4 copper heat pipes which are universally compatible with Intel® and AMD boards. Superbly engineered for maximum efficiency and ease of use. Modern Design for an Array of Applications Geometrically balanced case features a black anodised aluminium body with diamond-edge finish combined with bi-symmetrical extruded fins for a beautifully crafted modern case. Perfect for a wide range of applications and environments.  
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£177.59

Akasa Maxwell Pro Plus Aluminium Fanless Mini-ITX Case LGA1700 Ready Therm

[ Plus Version with Better Compatibility ] - Supports 65W TDP processors for both Intel and AMD Mini-ITX platforms. Includes retention plate for Intel LGA1700 socket. [ Customised Thermal Kit ] - Includes easily adjustable thermal module and copper heat pipes to ensure CPU receives optimal cooling. [ Efficient Heat Dissipation] - Bi-symmetrical e... morextruded fins and thermal kit maximise heat dissipation and enhance performance. Coupled with the vented panel to keep the components cool. [ Completely Silent ] - Fanless technology design eliminates the need for noisy mechanical fans so that true silence can be achieved. [ Use in Multiple Places ] - Maxwell Pro Plus features a black anodised aluminium body with diamond-edge finish. It can be used as a PC or HTPC for home theatre, media centre, office and personal space!
Amazon.co.uk
Delivery: to United Kingdom
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£186.38
Fanless Mini-ITX Case for Intel® LGA1700   Blending advanced passive cooling engineering and modern design to create a premium silent and compact case for Mini-ITX boards. Supports Intel® and AMD boards with common desktop processors up to 65W TDP. The perfect choice for gaming HTPCs & audiophile environments.    


65W TDP
  Perfect for the Intel® Alder Lake processors up to 65W Thermal Design Point (TDP) with increased contact surface area allowing for more heat to be dissipated at a time.





Advanced Performance

Bi-symmetrical extruded fins on either side of the case maximise the surface area of the exterior for increased heat dissipation. Coupled with internally hi-efficient passive thermal module and heat pipes to ensure the Thermal Design Power (TDP) is met.~





True Silent Experience

Fanless CPU design eliminates the need for noisy mechanical fans so that true silence can be achieved. Paired with the use of Solid State Drives one can truly immerse themselves in the experience of soundless acoustics. Breathability provided by multi-functional apertures which optimise natural convectional airflow is fused with contemporary design for a minimalist yet functional case.





Universal Socket Fitting & Easy Installation

Easily adjustable thermal module with 4 copper heat pipes which are universally compatible with Intel® and AMD boards. Superbly engineered for maximum efficiency and ease of use.





Modern Design for an Array of Applications

Geometrically balanced case features a black anodised aluminium body with diamond-edge finish combined with bi-symmetrical extruded fins for a beautifully crafted modern case. Perfect for a wide range of applications and environments.
 
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