80W-150W CP01 Heat Plate for Phone PCB Motherboard BGA Chip Removal Temperature Control 30-120C Heating Pad Tool
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80W-150W CP01 Heat Plate for Phone PCB Motherboard BGA Chip Removal Temperature Control 30-120C Heating Pad Tool | £47.54 |  | |||
Efficient Heating Solution: The Heat Plate is designed for precision heating in electronic repairs, suitable for phone PCBs and motherboard BGA chip...
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D, 6 channel(s), nom. 75 W, maximum 1200 W, pavement: 3 x 200 W, 12 – 22000 Hz, 104 dB, 4 Ohm, Bass Boost, ФНЧ, ФВЧ
D, 4 channel(s), nom. 100 W, maximum 1200 W, pavement: 2 x 300 W, 10 – 50000 Hz, 95 dB, 4 Ohm, Bass Boost, ФНЧ, ФВЧ
A/D, 4 channel(s), nom. 100 W, maximum 800 W, pavement: 2 x 200 W, 20 – 20000 Hz, 110 dB, 4 Ohm, Bass Boost, ФНЧ, ФВЧ
A/D, 4 channel(s), nom. 250 W, maximum 2000 W, pavement: 2 x 500 W, 20 – 20000 Hz, 75 dB, 4 Ohm, ФНЧ, ФВЧ
D, 1 channel(s), nom. 330 W, maximum 1100 W, 10 – 300 Hz, 65 dB, 8 Ohm, high voltage input, Bass Boost, ФИНЧ, ФНЧ
A/B, 2 channel(s), nom. 60 W, maximum 500 W, pavement: 1 x 190 W, 10 – 70000 Hz, 95 dB, 8 Ohm, ФНЧ
A/B, 4 channel(s), nom. 50 W, maximum 800 W, pavement: 2 x 200 W, 20 – 20000 Hz, 85 dB, 4 Ohm, high voltage input, Bass Boost, ФНЧ, ФВЧ, illuminate
A/D, 4 channel(s), nom. 150 W, maximum 1200 W, pavement: 2 x 300 W, 20 – 20000 Hz, 95 dB, 4 Ohm, Bass Boost, ФНЧ, ФВЧ
D, 4 channel(s), nom. 100 W, maximum 1500 W, pavement: 2 x 240 W, 15 – 35000 Hz, 75 dB, 4 Ohm, high voltage input, ФНЧ, ФВЧ
D, 1 channel(s), nom. 500 W, 10 – 500 Hz, 100 dB, 4 Ohm, phase control, Bass Boost, ФИНЧ, ФНЧ
A/B, 2 channel(s), nom. 50 W, maximum 300 W, pavement: 1 x 130 W, 5 – 50000 Hz, 95 dB, 4 Ohm, Bass Boost, ФНЧ, ФВЧ