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Sealey SD007 Hot Air Rework Station 300W
300W Hot air rework station with automatic cooling system. LED digital display showing current temperature and status. MCU confirms fast heat up accurate and stable control on temperature. Temperature Range of 100-500°C. Suitable for de-soldering work on various components such as SOIC CHIP QFP PLCC and BGA. Includes three nozzles.300W Hot Air... moreRework Station• 300W Hot air rework station with automatic cooling system.• LED digital display showing current temperature and status.• MCU confirms fast heat up accurate and stable control on temperature.• Temperature range: 100-500°C.• Suitable for de-soldering work on various components such as SOIC CHIP QFP PLCC and BGA.• Includes three nozzles.• Model No. SD007Model No: SD007:Brand: Sealey:Frequency: 50Hz:Nett Weight: 1.25kg:Power: 300W:Temperature Range: 100-500?(212-932DegF):PTDSEASD007
300W Hot air rework station with automatic cooling system. LED digital display, showing current temperature and status. MCU confirms fast heat up, accurate and stable control on temperature. Temperature Range of 100-500°C. Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA. Includes three nozzles. Features &... moreBenefits: • 300W Hot air rework station with automatic cooling system. • LED digital display, showing current temperature and status. • MCU confirms fast heat up, accurate and stable control on temperature. • Temperature range: 100-500°C. • Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA. • Includes three nozzles. • Model No. SD007 Specifications: Model No SD007 Brand: Sealey Frequency: 50Hz Nett Weight: 1.25kg Power: 300W Temperature Range: 100-500?(212-932°F)
300W Hot air rework station with automatic cooling system. LED digital display, showing current temperature and status. MCU confirms fast heat up, accurate and stable control on temperature. Temperature Range of 100-500°C. Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA. Includes three nozzles. Features &... moreBenefits: • 300W Hot air rework station with automatic cooling system. • LED digital display, showing current temperature and status. • MCU confirms fast heat up, accurate and stable control on temperature. • Temperature range: 100-500°C. • Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA. • Includes three nozzles. • Model No. SD007 Specifications: Model No SD007 Brand: Sealey Frequency: 50Hz Nett Weight: 1.25kg Power: 300W Temperature Range: 100-500?(212-932°F)
300W Hot air rework station with automatic cooling system. LED digital display, showing current temperature and status. MCU confirms fast heat up, accurate and stable control on temperature. Temperature Range of 100-500°C. Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA. Includes three nozzles. Features &... moreBenefits: • 300W Hot air rework station with automatic cooling system. • LED digital display, showing current temperature and status. • MCU confirms fast heat up, accurate and stable control on temperature. • Temperature range: 100-500°C. • Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA. • Includes three nozzles. • Model No. SD007 Specifications: Model No SD007 Brand: Sealey Frequency: 50Hz Nett Weight: 1.25kg Power: 300W Temperature Range: 100-500?(212-932°F)
300W Hot air rework station with automatic cooling system. LED digital display, showing current temperature and status. MCU confirms fast heat up, accurate and stable control on temperature. Temperature Range of 100-500°C. Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA. Includes three nozzles. Features & Benefits: • 300W Hot air rework station with automatic cooling system. • LED digital display, showing current temperature and status. • MCU confirms fast heat up, accurate and stable control on temperature. • Temperature range: 100-500°C. • Suitable for de-soldering work on various components such as SOIC, CHIP, QFP, PLCC and BGA. • Includes three nozzles. • Model No. SD007 Specifications: Model No SD007 Brand: Sealey Frequency: 50Hz Nett Weight: 1.25kg Power: 300W Temperature Range: 100-500?(212-932°F)
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