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Optimised Packaging Saves Resources A sustainable use of resources is really important for us at ARCTIC Thus we updated the packaging of the MX-4 to minimize it's CO2 Footprint. The practical recyclable packaging bag of our thermal compound helps us to reduce the environmental impact of packaging materials by about 40% and thereby save resources. Better than Liquid Metal The ARCTIC MX-4 compound is composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated quickly and efficiently. Superb in performance MX-4 is the best companion for overclockers and enthusiasts. Easy to Apply With …

Optimised Packaging Saves Resources A sustainable use of resources is really important for us at ARCTIC Thus we updated the packaging of the MX-4 to minimize it's CO2 Footprint. The practical recyclable packaging bag of our thermal compound helps us to reduce the environmental impact of packaging materials by about 40% and thereby save resources. Better than Liquid Metal The ARCTIC MX-4 compound is composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated quickly and efficiently. Superb in performance MX-4 is the best companion for overclockers and enthusiasts. Easy to Apply With …

Wipes for removing Thermal Compounds (40 Pieces)   Perfect Cleaning The MX Cleaner dissolves old and heavily dried thermal paste such as your MX-2 or MX-4 so that it can be picked up and removed with the cloth without any problems.   Residue-Free Removal In contrast to cleaning with handkerchiefs household rolls or cloth wipes the thermal paste does not smear on the processor but is cleanly loosened from the surface and removed. Even stubborn traces and residues of heat conductive pads can be reliably removed.   Gentle Active Ingredients ARCTIC's MX Cleaner is limonene-based and contains neither alcohols nor benzenes. This …

High Performance — Very Soft Based on silicone and a special filler TP-3 outperforms high-performance pads especially when height differences of closely spaced chips typically occur due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite extremely low hardness. Minimization of Thermal Resistance The thinner the pad the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness the installation of the 0.5 mm pad requires extra care. Please refer …