Cooler Master IC Essential E1 (RG-ICE1-TG15-R1)
Photos 4 | Outdated Product £4.43 Relatively affordable thermal paste from Cooler Master, known for its balanced air cooling systems, as well as cases and power supplies. Suitable for a wide range of users who purchase a thermal interface for the assembly or maintenance of PCs, laptops and video cards. It can be used for moderate overclocking. Due to its high electrical resistance, it practically does not conduct electricity. Thermal paste Cooler Master IC Essential E1 comes in a transparent blister, inside which there is a plastic syringe containing 1.5 g of paste, instructions and a small plastic spatula that helps to evenly distribute the thermal interface over the surface. This amount of product is enough for a couple of processor installations with a large heat spreader cover (Intel LGA3647, AMD TR4) or 4-6 CPU instal...lations with a small heat dissipation area (LGA1150/1151/1155/1156/1200). The thermal conductivity declared by the manufacturer (>4.5 W/m∙K) is not a record one, but its value is quite enough to serve powerful central processors and video cards. The moderately viscous consistency helps to effectively fill small irregularities in the contact surfaces to completely remove air from the heat transfer zone. |
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Relatively affordable thermal paste from Cooler Master, known for its balanced air cooling systems, as well as cases and power supplies. Suitable for a wide range of users who purchase a thermal interface for the assembly or maintenance of PCs, laptops and video cards. It can be used for moderate overclocking. Due to its high electrical resistance, it practically does not conduct electricity.
Thermal paste Cooler Master IC Essential E1 comes in a transparent blister, inside which there is a plastic syringe containing 1.5 g of paste, instructions and a small plastic spatula that helps to evenly distribute the thermal interface over the surface. This amount of product is enough for a couple of processor installations with a large heat spreader cover (Intel LGA3647, AMD TR4) or 4-6 CPU installations with a small heat dissipation area (LGA1150/1151/1155/1156/1200). The thermal conductivity declared by the manufacturer (>4.5 W/m∙K) is not a record one, but its value is quite enough to serve powerful central processors and video cards. The moderately viscous consistency helps to effectively fill small irregularities in the contact surfaces to completely remove air from the heat transfer zone.
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