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Thermal Pastes & Thermal Pads Halnziye

 prices on 16 models  
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Thermal Paste Halnziye HY-881 2g
thermal Paste, 2 g, thermal conductivity 5.6 W/mK, scraper

Thermal Paste Halnziye HY-880 15g
thermal Paste, 15 g, thermal conductivity 5.15 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-710 10g
thermal Paste, 10 g, thermal conductivity 3.17 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-510 150g
thermal Paste, 150 g, thermal conductivity 1.93 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-410 5g
thermal Paste, 5 g, thermal conductivity 1.42 W/mK, operating temperature -30 — 280 °С, no scraper

18.47Buy!
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20g Gold Silicone Compound Thermal Grease Paste for PC CPU Heatsink Chipset VGA GPU Ovens Cooling
13.79Buy!
£
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Dimensions (H x W): 5 x 5 cm Thickness: 1 mm Thermal Conductivity: 4.0W/m-K Thermal impedance:
13.62Buy!
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Dimensions: 10 x 10 cm (height x width) Thickness: 0.5 cm Thermal Conductivity: 2.0W/m-K Thermal impedance: 0.18~0.25°C-in^2/W Colour: grey
34.80Buy!
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Box contents: 5 x HY710 30 g (150 g) Thermal Conductivity: >3.17 W/m-K Thermal impedance:
14.18Buy!
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Series: HY510 - Package type: Syringe - Content: 30g - Quantity: 1 pcs - Total Content: 30g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.2 ° C-in²/W - Specific Gravity: > 2.0 g/cm³ Vi more→scosity: 1000 - Thixotropic Index: 380±10 1/10 mm Moment Bore Temperature: -50 +280°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%
12.17Buy!
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Box contents: 1 g Thermal Conductivity & # xff1e. 1.36 W/m-k Thermal Impedance & # xff1 C. 0.229 C-in²/W Apply to CPU, VGA, LED, Chipset Radiator and other PC components Color: White
35.72Buy!
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Series: HY810 - Package type: Syringe - Content: 20g - Quantity: 5 pcs - Total Content: 100g Thermal Conductivity: > 4.63 W/m-K - Thermal Impedance: < 0°C-in²/W - Specific Gravity: > 3 g/cm³ Viscosi more→ty: 12500 - Thixotropic Index: 280±10 1/10 mm Moment Bore Temperature: -50 +300°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 15% - Carbon Compound 35% - Metal Oxide Compound 50%
26.68Buy!
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Series: HY510 - Package type: Syringe - Content: 30g - Quantity: 3 pcs - Total Content: 90g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.225 °C-in2/W - Specific Gravity: > 2 g/cm3 Vis more→cosity: 1000 - Thixotropic Index: 380±10 1/10 Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +280 °C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%
20.24Buy!
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High stability and reliability Excellent Thermal Conductivity:>3.17W/(m-K) Odorless, low oil content, non-volatile, non-corrosive, non-toxic, flame retardant, not electrically conductive. Grease cl more→eaner and applicator included
17.38Buy!
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Package Content: 10x HALNZIYE HY810 0.5g (5g) Thermal Conductivity: >4.63 W/m-K Thermal Impedance:
16.20Buy!
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Thermal Conductivity: 1.42W/m-K Helps disperse the heat from CPU to heatsink effectively. Thermal Resistance:
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