Comparison AMD Ryzen 9 Raphael 7900 BOX vs AMD Ryzen 9 Vermeer 5900X BOX

This parameter characterizes, firstly, the technical process (see above), and secondly, some features of the internal structure of processors. A new (or at least updated) codename is introduced to the market with each new CPU generation; chips of the same architecture are "coevals", but may belong to different series (see above). At the same time, one generation can include both one and several code names.

Here are the most common Intel codenames today: Cascade Lake-X (10th gen), Comet Lake (10th gen), Comet Lake Refresh (10th generation), Rocket Lake (11th generation), Alder Lake (12th generation), Raptor Lake (13th generation), Raptor Lake Refresh (14th generation).

For AMD, this list includes Zen+ Picasso, Zen2 Matisse, Zen2 Renoir, Zen3 Vermeer, Zen3 Cezanne, Zen4 Raphael, Zen4 Phoenix and Zen5 Granite Ridge.

The type of connector (socket) for installing the processor on the motherboard. For normal compatibility, it is necessary that the CPU and motherboard match the socket type; before buying one and the other, this point should be clarified separately

The following sockets are relevant for Intel processors today: 1150, 1155, 1356, 2011, 2011 v3, 2066, 1151, 1151 v2, 3647, 1200, 1700, 1851.

In turn, AMD processors are equipped with the following types of connectors: <AM3/AM3+, FM2/FM2+, AM4, AM5, TR4/TRX4, WRX8.

The technical process by which the CPU is manufactured.

The parameter is usually specified by the size of the individual semiconductor elements (transistors) that make up the processor integrated circuit. The smaller their size, the more advanced the technical process is considered: miniaturization of individual elements allows you to reduce heat generation, reduce the overall size of the processor and at the same time increase its flow Rate. CPU manufacturers are trying to move towards reducing the technical process, and the newer the processor, the lower the numbers you can see at this point.

The technical process is measured in nanometers (nm). In the modern arena of central processors, solutions made using the 7 nm, 10 nm, 12 nm process technology predominate, high-end CPU models are manufactured using the 4 nm and 5 nm process technology, 14 nm and 22 nm solutions are still afloat, and are rapidly fading into the background, but 28 nm and 32 nm occur periodically.

This parameter does not so much indicate the difference in technical characteristics as it describes the packaging and computer Hardware.

- OEM. The tray package, or OEM, provides that the processor is supplied without a cooling system (CO) and without a branded box - the packaging is usually a simple antistatic bag. You need to select and install cooling for such a CPU separately. In addition, components in tray packaging often have a shorter warranty period than in the box version, and their additional equipment is more meager. On the other hand, such solutions are noticeably cheaper, and the absence of CO allows you to select it separately, without relying on the manufacturer’s choice.

— BOX (without cooler). Processors packed in branded boxes, but not equipped with cooling systems (CO). Such packaging is more expensive than OEM, but the warranty period for “boxed” chips is usually much longer (for example, three years instead of one). The absence of a cooler, on the one hand, requires additional efforts to find and install a coolant; on the other hand, cooling can be selected according to your own criteria, without relying on the manufacturer’s choice. However, it is worth considering that when installing a cooler yourself, it is difficult to achieve the same efficiency from it as with a factory installation; This is especially critical if the CPU is planned to be intensively overc...locked; for such modes it is better to choose a box package with a cooler.

— BOX (with cooler). Processors packed in branded boxes and equipped with cooling systems (CO). Box packaging itself is more expensive than OEM, but this is compensated by a number of advantages - in particular, more extensive packaging and a longer warranty period. As for the presence of a cooler in the kit, it further increases the overall cost of the CPU, but eliminates the need to bother with the selection and installation of a separate cooling system. It is worth noting that the factory installation of CO allows you to achieve higher efficiency than independent installation, so for high loads (including overclocking) this particular configuration option is best suited. On the other hand, before purchasing, you need to check whether there is enough space in the case for a cooler: complete coolers can be quite bulky, and removing them can be difficult.

— MPK (with cooler, without box). The multipack package, or MPK for short, implies the delivery of a processor with a standard boxed cooling cooler, but without a box and accompanying documentation. The processor is usually packaged in a simple antistatic bag. The MPK package is more expensive than OEM due to the presence of a cooling system, but cheaper than BOX (with cooler) due to the absence of a box. At the same time, the multipack kit usually has a shorter warranty period than the BOX delivery option (with a cooler).

The maximum processor clock speed that can be reached when running in Turbo Boost or Turbo Core overclocking mode.

The name "Turbo Boost" is used for the overclocking technology used by Intel, "Turbo Core" for the solution from AMD. The principle of operation in both cases is the same: if some cores are not used or work under a load below the maximum, the processor can transfer part of the load from the loaded cores to them, thus increasing computing power and performance. Operation in this mode is characterized by an increase in the clock frequency, and it is indicated in this case.

Note that we are talking about the maximum possible clock frequency — modern CPUs are able to regulate the operating mode depending on the situation, and with a relatively low load, the actual frequency may be lower than the maximum possible. See "Clock frequency" for the general meaning of this parameter.

The amount of Level 1 (L1) cache provided by the processor.

Cache is an intermediate memory buffer into which the most frequently used data from RAM is written when the processor is running. This speeds up access to them and has a positive effect on system performance. The larger the cache, the more data can be stored in it for quick access and the higher the performance. Level 1 cache has the highest performance and the smallest volume — up to 128 KB. It is an integral part of any processor.

The amount of Level 2 (L2) cache provided by the processor.

Cache is an intermediate memory buffer into which the most frequently used data from RAM is written during processor operation. This speeds up access to them and has a positive effect on system performance. The larger the cache, the more data can be stored in it for quick access and the higher the performance. Level 2 cache volume can reach 12 MB, the vast majority of modern processors have such a cache.

Model of the integrated video core installed in the processor. See "Integrated Graphics" for details on the core itself. And knowing the name of the graphics chip model, you can find its detailed characteristics and clarify the performance of the processor when working with video.

In terms of specific models, Intel processors use HD Graphics, specifically 510, 530, 610, 630 and UHD Graphics with models 610, 630, 730, 750, 770. AMD chips, in turn, can carry Radeon Graphics, Radeon R5 series, Radeon R7 series, and Radeon RX Vega graphics cards.

At the same time, processors without a graphics core are appropriate for purchase if you plan to fully assemble a PC with a graphics card. In this case, overpaying for a processor with a graphics core does not make sense.

The amount of heat generated by the processor during normal operation. This parameter determines the requirements for the cooling system necessary for the normal operation of the processor, therefore it is sometimes called TDP — thermal design power, literally “thermal (cooling) system power”. Simply put, if the processor has a heat dissipation of 60 W, it needs a cooling system that can remove at least this amount of heat. Accordingly, the lower the TDP, the lower the requirements for the cooling system. Low TDP values(up to 50 W) are especially critical for PCs that do not have the ability to install powerful cooling systems — in particular, systems in compact cases where a powerful cooler simply does not fit.