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Comparison G.Skill Ares DDR3 2x8Gb F3-2400C11D-16GAB vs G.Skill Ripjaws-X DDR3 2x8Gb F3-2400C11D-16GXM

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G.Skill Ares DDR3 2x8Gb F3-2400C11D-16GAB
G.Skill Ripjaws-X DDR3 2x8Gb F3-2400C11D-16GXM
G.Skill Ares DDR3 2x8Gb F3-2400C11D-16GABG.Skill Ripjaws-X DDR3 2x8Gb F3-2400C11D-16GXM
from £71.79 
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Memory capacity16 GB16 GB
Memory modules22
Form factorDIMMDIMM
TypeDDR3DDR3
Specs
Memory speed2400 MHz2400 MHz
Clock speed19200 MB/s19200 MB/s
CAS latencyCL11CL11
Memory timing11-13-13-31-2N11-13-13-31-2N
Voltage1.65 V1.5 V
Coolingradiatorradiator
Module profilestandardstandard
More features
overclocking series
 
overclocking series
XMP
Added to E-Catalogoctober 2013october 2013

Voltage

The nominal voltage required for the operation of the memory module. When choosing memory, you must pay attention to the fact that the appropriate voltage is supported by the motherboard.

More features

— A series for overclocking (overclocking). Belonging to such a series means that the manufacturer initially provided in the module the possibility of overclocking ("overclocking") — that is, increasing performance by changing the operating parameters, in particular, increasing the operating voltage and clock frequency. You can also “overclock” ordinary memory that is not related to overclocking — however, this is difficult and fraught with failures, up to complete burnout of the circuits, while in specialized series overclocking is a documented function, it is implemented quickly and simply, moreover, it is most often covered by a guarantee.

XMP support. Memory module compatibility with XMP technology. This technology, created by Intel, is used for overclocking (see the relevant paragraph). Its key principle is that certain overclocking profiles are recorded in the memory module — sets of settings tested for stability; and instead of manually setting individual parameters, the user just needs to select one of the profiles. This simplifies system setup and at the same time improves its reliability during overclocking. However, note that in order to use XMP, it must be supported not only by memory, but also by the motherboard.

— AMP support. Memory module compatibility with AMP technology. In terms of its main features, this technology is completely similar to the XMP described above and differs only in the creator — in this case, it is AMD.

EXPO support. Memory module compatibility with EXPO technology (Extended Profiles for Overclocking). It was created at AMD by a specialist for overclocking DDR5 strips as part of Ryzen 7000 systems. At its core, this is a factory set of RAM profiles that simplifies overclocking the “RAM”. Using the technology allows you to increase performance in games by about 11% with a resolution of the broadcast image Full HD.

Buffering support (Registered). The presence of the so-called memory module. buffer — a section for quickly saving incoming data — between the memory controller (control device) and the actual chips (storage devices). This scheme reduces the load on the controller, thereby achieving higher reliability; on the other hand, buffered modules have slightly reduced performance due to the delay in transferring information through the buffer. Buffered memory is used mainly in server systems and is expensive. When choosing memory, note that either only buffered or only unbuffered memory can be used in one system; it is impossible to combine these two types of memory.

ECC support. ECC (Error Checking and Correction) is a technology that allows you to correct minor errors that occur while working with data. To use ECC, it must be supported not only by the memory module, but also by the motherboard; Basically, such support is used in servers, but it is also found in "motherboards" for ordinary desktops.