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Comparison GOODRAM PX600 SSDPR-PX600-1K0-80 1 TB vs Lexar NM710 LNM710X001T 1 TB

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GOODRAM PX600 SSDPR-PX600-1K0-80 1 TB
Lexar NM710 LNM710X001T 1 TB
GOODRAM PX600 SSDPR-PX600-1K0-80 1 TBLexar NM710 LNM710X001T 1 TB
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Main
Compatible with PlayStation 5. PCIe 4.0 bus. Speed 5000 MB/s.
Placementinternalinternal
Size1000 GB1000 GB
Form factorM.2M.2
M.2 interfacePCI-E 4.0 4xPCI-E 4.0 4x
Technical specs
Memory type3D NAND3D TLC NAND
NVMe
Write speed3200 MB/s4500 MB/s
Read speed5000 MB/s5000 MB/s
MTBF2 m h1.5 m h
TBW300 TB600 TB
DWPD0.3 times/day0.3 times/day
Manufacturer's warranty3 years5 years
General
M.2 coolinggraphene heatsink
Size22x80 mm22x80 mm
Added to E-Catalogmay 2023february 2023

Memory type

The type of the main memory of the drive determines the features of the distribution of information over hardware cells and the physical features of the cells themselves.

MLC. Multi Level Cell memory based on multi-level cells, each of which contains several signal levels. MLC memory cells store 2 bits of information. Has optimum indicators of reliability, power consumption and productivity. Until recently, the technology was popular in entry-level and mid-range SSD modules, now it is gradually being replaced by more advanced options in the manner of TLC or 3D MLC.

TLC. The evolution of MLC technology. One Flash Memory Triple Level Cell can store 3 bits of information. Such a recording density somewhat increases the likelihood of errors compared to MLC, in addition, TLC memory is considered less durable. A positive feature of the nature of this technology is its affordable cost, and various design tricks can be used to improve reliability in SSDs with TLC memory.

3D NAND. In a 3D NAND structure, several layers of memory cells are arranged vertically, and interconnections are organized between them. This provides greater storage capacity without increasing the physical size of the drive and improves memory performance due to shorter connections for each memory cell. In SSD drives, 3D NAND memory can use MLC, TLC or QLC chips - more details...about them are described in the corresponding help paragraphs.

3D MLC NAND. MLC-memory has a multilayer structure — its cells are placed on the board not in one level, but in several "floors". As a result, manufacturers have achieved an increase in storage capacity without a noticeable increase in size. Also, 3D MLC NAND memory is characterized by higher reliability than the original MLC (see the relevant paragraph), at a lower manufacturing cost.

3D TLC NAND. "Three-dimensional" modification of the TLC technology (see the relevant paragraph) with the placement of memory cells on the board in several layers. This arrangement allows you to achieve higher capacity with smaller sizes of the drives themselves. In production, such memory is simpler and cheaper than a single-layer one.

3D QLC NAND. Quad Level Cell flash type with 4 bits of data in each cell. The technology is designed to make SSDs with large volumes widely available and finally retire traditional HDDs. In the 3D QLC NAND configuration, the memory is built according to a “multi-level” scheme with the placement of cells on the board in several layers. "Three-dimensional" structure reduces the cost of production of memory modules and allows you to increase the volume of drives without compromising their weight and size component.

3D XPoint. A fundamentally new type of memory, radically different from traditional NAND. In such drives, memory cells and selectors are located at the intersections of perpendicular rows of conductive tracks. The mechanism for recording information in cells is based on changing the resistance of the material without the use of transistors. 3D XPoint memory is simple and inexpensive to produce, and offers much better speed and durability. The prefix "3D" in the name of the technology says that the cells on the crystal are placed in several layers. The first generation of 3D XPoint received a two-layer structure and was made using a 20-nanometer process technology.

Write speed

The highest speed in write mode characterizes the speed with which the module can receive information from a connected computer (or other external device). This speed is limited both by the connection interface (see "Connector"), and by the characteristics of the device of the SSD itself.

MTBF

The drive's time between failures is the time that it is able to continuously work without failures and malfunctions; in other words — the operating time, after which there is a high probability of failures, and even failure of the module.

Usually, the characteristics indicate some average time derived from the results of conditional testing. Therefore, the actual value of this parameter may differ from the claimed one in one direction or another; however, in fact, this moment is not particularly significant. The fact is that for modern SSDs, the MTBF is estimated at millions of hours, and 1 million hours corresponds to more than 110 years — while we are talking about pure operating time. So, from a practical point of view, the durability of a drive is often limited by more specific parameters — TBW and DPWD (see below); and the manufacturer's warranty generally does not exceed several years. However, data on the MTBF in hours can also be useful when choosing: other things being equal, more time means more reliability and durability of the SSD as a whole.

TBW

The abbreviation TBW stands for drive time between failures, expressed in terabytes. In other words, this is the total amount of information that is guaranteed to be written (rewritten) to this module. This metric measures the overall reliability and lifespan of a drive—the higher the TBW, the longer the device will last, all other things being equal.

Note that knowing the TBW and the warranty period, you can calculate the number of rewrites per day (DWPD, see the relevant paragraph), if the manufacturer did not specify these data. To do this, use the formula: DWPD = TBW / (V * T * 365), where V is the drive capacity in terabytes, T is the warranty period (years). As for specific numbers, there are a lot of drives on the market with a relatively low TBW — up to 100 TB ; even these values are often sufficient for everyday use for a considerable amount of time. However, models with TBW at the level of 100 – 500 TB are more common. Values of 500 – 1000 TB can be classified as "above average", and in the most reliable solutions this figure is even higher.

Manufacturer's warranty

Manufacturer's warranty provided for this model.

In fact, this is the minimum service life promised by the manufacturer, subject to the rules of operation. Most often, the actual service life of the device is much longer than the guaranteed one. However, keep in mind that the warranty often includes additional terms, such as “[so many years] or until the TBW is exhausted” (for more on TBW, see above).

Specific warranty periods may vary even for similar drives from the same manufacturer. The most popular options are 3 years and 5 years, however, there are other figures — up to 10 years in the most expensive and high-end models.

M.2 cooling

The presence of a cooling radiator in the design of the M.2 form factor drive.

The heatsink is usually a metal plate attached to the drive board. It improves heat dissipation, which is especially important under high loads associated with handling large amounts of information. M.2 drives with a heatsink are intended mainly for high-performance systems, in particular gaming ones.

There is also a special type of thin and light graphene radiators. They are glued to the surface of the M.2 SSD, covering the key areas (controller and memory chips) that generate the most heat. This allows heat to be distributed more evenly and its accumulation to be minimized.

We also note that M.2 radiators are found as equipment on motherboards. So if the drive itself does not have this function, you can choose a “motherboard” with a radiator for it.
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