Thermal Pastes & Thermal Pads Halnziye

Dimensions (H x W): 5 x 5 cm Thickness: 1 mm Thermal Conductivity: 4.0W/m-K Thermal impedance:

Halnziye HY810 30g Ultra High Performance Nano Thermal Grease Paste for i3/i5/i7

Series: HY510 - Package type: Syringe - Content: 5g - Quantity: 1 pcs - Total Content: 5g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.225 °C-in2/W - Specific Gravity: > 2 g/cm3 Viscosity: 1000 - Thixotropic Index: 380±10 1/10 Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +280 °C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%

Thermal Conductivity: >1.93 W/mK Thermal Resistance:

Package Content: 10x HY710 0.5g (5g) Thermal Conductivity: >3.17 W/m-K Thermal Impedance:

Box contents: 5 x HY710 30 g (150 g) Thermal Conductivity: >3.17 W/m-K Thermal impedance:

Thermal Conductivity: >1.93 W/mK Thermal Resistance:

Thermal Conductivity: 1.42W/m-K Helps disperse the heat from CPU to heatsink effectively. Thermal Resistance:

Dimensions: 10 x 10 cm (height x width) Thickness: 0.5 cm Thermal Conductivity: 2.0W/m-K Thermal impedance: 0.18~0.25°C-in^2/W Colour: grey

Nanometer Super Conductive Thermal Grease Paste (5.15 W/m-k) Thermal Conductivity is 2.6 W/m-K to 4.5 W/m-k High Quality, and Low thermal impedance, (Can endure paste state) Wide operation temperature range, can keep stable performance (Between -55~300°C) High Heat Dissipation Performance, and Cost-Effective