Thermal Pastes & Thermal Pads Halnziye

Package Contents: 3x HY510 100g (300g) Thermal Conductivity: >1.93 W/m-K Thermal Impedance:

Series: HY810 - Package type: Syringe - Content: 20g - Quantity: 5 pcs - Total Content: 100g Thermal Conductivity: > 4.63 W/m-K - Thermal Impedance: < 0°C-in²/W - Specific Gravity: > 3 g/cm³ Viscosity: 12500 - Thixotropic Index: 280±10 1/10 mm Moment Bore Temperature: -50 +300°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 15% - Carbon Compound 35% - Metal Oxide Compound 50%

Box contents: 5 x HY710 30 g (150 g) Thermal Conductivity: >3.17 W/m-K Thermal impedance:

Series: HY510 - Package type: Syringe - Content: 30g - Quantity: 3 pcs - Total Content: 90g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.225 °C-in2/W - Specific Gravity: > 2 g/cm3 Viscosity: 1000 - Thixotropic Index: 380±10 1/10 Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +280 °C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%

Dimensions: 15 x 15 cm (height x width) Thickness: 1 mm Thermal Conductivity: 4.0W/m-K Thermal impedance:

Thermal Conductivity: 1.42W/m-K Helps disperse the heat from CPU to heatsink effectively. Thermal Resistance:

Series: HY510 - Package type: Syringe - Content: 30g - Quantity: 1 pcs - Total Content: 30g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.2 ° C-in²/W - Specific Gravity: > 2.0 g/cm³ Viscosity: 1000 - Thixotropic Index: 380±10 1/10 mm Moment Bore Temperature: -50 +280°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%

Dimensions (H x W): 5 x 5 cm Thickness: 1 mm Thermal Conductivity: 4.0W/m-K Thermal impedance:

Dimensions: 10 x 10 cm (height x width) Thickness: 0.5 cm Thermal Conductivity: 2.0W/m-K Thermal impedance: 0.18~0.25°C-in^2/W Colour: grey

Package Content: 10x HY710 0.5g (5g) Thermal Conductivity: >3.17 W/m-K Thermal Impedance:

Package Content: 3x HY710 0.5g (1.5g) Thermal Conductivity: >3.17 W/m-K Thermal Impedance:

Package contents: 10x HALNZIYE HY410 0.5 g (5 g) Thermal Conductivity: >1.42W/m-K Thermal Impedance:

Halnziye HY810 30g Ultra High Performance Nano Thermal Grease Paste for i3/i5/i7

Thermal Conductivity: >3.17 W/mK Thermal Resistance:

Nanometer Super Conductive Thermal Grease Paste (5.15 W/m-k) Thermal Conductivity is 2.6 W/m-K to 4.5 W/m-k High Quality, and Low thermal impedance, (Can endure paste state) Wide operation temperature range, can keep stable performance (Between -55~300°C) High Heat Dissipation Performance, and Cost-Effective