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Thermal Pastes & Thermal Pads Halnziye

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Thermal Paste Halnziye HY-880 30g
thermal Paste, 30 g, thermal conductivity 5.15 W/mK, operating temperature -30 — 280 °С, scraper

Thermal Paste Halnziye HY-510 30g
thermal Paste, 30 g, thermal conductivity 1.93 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-T1 2g
thermal Paste, 2 g, thermal conductivity 8.3 W/mK, scraper

Thermal Paste Halnziye HY-710 10g
thermal Paste, 10 g, thermal conductivity 3.17 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-710 1g
thermal Paste, 1 g, thermal conductivity 3.17 W/mK, operating temperature -30 — 240 °С, no scraper

Thermal Paste Halnziye HY-880 15g
thermal Paste, 15 g, thermal conductivity 5.15 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-881 2g
thermal Paste, 2 g, thermal conductivity 5.6 W/mK, scraper

Thermal Paste Halnziye HY-410 5g
thermal Paste, 5 g, thermal conductivity 1.42 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-810 2g
thermal Paste, 2 g, thermal conductivity 4.63 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-510 150g
thermal Paste, 150 g, thermal conductivity 1.93 W/mK, operating temperature -30 — 280 °С, no scraper

2.55Buy!
£
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Halnziye HY610 Gold 2g Thermal Grease Paste with Spreader for CPU Heat Transfers Thermal Conductivity: > 3,05 W/m-K - Thermal Impedance: < 0,073 °C-in²/W - Specific Gravity: > 2,48 g/cm³ Viscosity: more→1000 - Thixotropic Index: 380±10 1/10mm Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +240 °C Composizione: Silicone Compound 30% - Carbon Compound 20% - Metal Oxide Compound 50%
35.70Buy!
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Series: HY810 - Package type: Syringe - Content: 20g - Quantity: 5 pcs - Total Content: 100g Thermal Conductivity: > 4.63 W/m-K - Thermal Impedance: < 0°C-in²/W - Specific Gravity: > 3 g/cm³ Viscosi more→ty: 12500 - Thixotropic Index: 280±10 1/10 mm Moment Bore Temperature: -50 +300°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 15% - Carbon Compound 35% - Metal Oxide Compound 50%
3.95Buy!
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EXCELLENT PERFORMANCE: HY610 is a Gold based Thermal compound typically used for CPU heat transfers as well as for a wide range of products including UPS, transformers and regulators, Routers and mode more→ms, LED Lights, Sky Boxes etc. and LCD TV's. HIGH PERFORMANCE: HY610 tends to form a thinner layer between CPU & Heat sink than other greases and even under low pressure - so is ideal for superior heat transfers of heat-pipe direct contact or heat-pipe direct touch CPU coolers. SAFE APPLICATION: Compliance with RoHS, REACH, PFOS requirements. HIGH DURABILITY: Excellent for both thermal conductivity with a low heat resistance and for maintaining a durable paste like state. Plus for it's wide temperature …
2.25Buy!
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Thermal Conductivity: >1.93 W/mK Thermal Resistance:
4.25Buy!
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Halnziye HY810 30g Ultra High Performance Nano Thermal Grease Paste for i3/i5/i7
2.25Buy!
£
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Thermal Conductivity: >1.93 W/mK Thermal Resistance:
26.69Buy!
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Series: HY510 - Package type: Syringe - Content: 30g - Quantity: 3 pcs - Total Content: 90g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.225 °C-in2/W - Specific Gravity: > 2 g/cm3 Vis more→cosity: 1000 - Thixotropic Index: 380±10 1/10 Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +280 °C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%
47.93Buy!
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Package Contents: 3x HY510 100g (300g) Thermal Conductivity: >1.93 W/m-K Thermal Impedance:
19.81Buy!
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High stability and reliability Excellent Thermal Conductivity:>3.17W/(m-K) Odorless, low oil content, non-volatile, non-corrosive, non-toxic, flame retardant, not electrically conductive. Grease cl more→eaner and applicator included
5.75Buy!
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Package Content: 3x HY710 0.5g (1.5g) Thermal Conductivity: >3.17 W/m-K Thermal Impedance:
2.25Buy!
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Thermal Conductivity: >1.93 W/mK Thermal Resistance:
2.85Buy!
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Halnziye HY810 (5g) tube Nano Thermal Grease Paste (4.63 W/m-k) for 1.4GHz+ CPU
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