Thermal Pastes & Thermal Pads

Product information - AM5 High Performance Heatspreader - Replaces SAM and heat spreader - 240% larger surface area (22 cm²) - Made from nickel plated copper - Diamond milled precision surface - Compatible with air and water coolers For delidded CPUs only! The Thermal Grizzly AM5 High Performance Heatspreader in detail The AM5 High Performance Heatspreader is an upgrade heatspreader for AMD's Ryzen 7000 processors. The nickel-plated copper heat spreader features a 240 percent larger, precision diamond-milled surface. This increased surface area compared to the original heatspreader allows for maximum heat dissipation on both air and water coolers, while precision milling ensures extremely …

Average Particle Size: less than 0.49 micron less than 0.000020 inch Extended Temperature Limits: Peak: �50oC to more than 180oC Long-Term: �50oC to 130oC Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gRAM syringe contains enough compound to cover at least 15 to 25 small CPU cores or 6 to 10 large CPU cores or 2 to 5 heat plates. At a layer 0.003" thick the 3.5 gRAM syringe will cover approximately 16 square inches.

Passive heatsink designed for Intel Optane SSD 905P M.2 Reduces thermal throttling and improves drive performance Compact design reduces interfere with other components Material: Aluminum front and backplates with steel clips

Made With 99.9% Pure Silver High-Density Controlled Triple-Phase Viscosity Not Electrically Conductive Absolute Stability

Premium silver polysynthetic thermal compound Use between CPU's and heatsinks or water-cooling solutions Will not separate, run, migrate, or bleed Does not contain any silicone 3.5 gram tube will cover 20 to 30 small cpu's

Series: HY810 - Package type: Syringe - Content: 20g - Quantity: 5 pcs - Total Content: 100g Thermal Conductivity: > 4.63 W/m-K - Thermal Impedance: < 0°C-in²/W - Specific Gravity: > 3 g/cm³ Viscosity: 12500 - Thixotropic Index: 280±10 1/10 mm Moment Bore Temperature: -50 +300°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 15% - Carbon Compound 35% - Metal Oxide Compound 50%

Box contents: 5 x HY710 30 g (150 g) Thermal Conductivity: >3.17 W/m-K Thermal impedance:

Thermal conductivity: 2.5 W/m-k Density: 2.5 g/cm3 Operating temperature: -40 - 150 ° Colour: Grey Kit Contents: 1 x Quick Start Guide 1 x Thermal Paste (Application Syringe) 1 x ROG Spreader 4 x ROG Stencils 2 x Cleaning Wipes

COMPACT AIR COOLER - The 136mm low-profile Hyper H412R is ideal for high-performance CPU cooling in compact SFF motherboards or cases with limited clearance HIGH THERMAL CONDUCTIVITY – At 9 W/mK., the MasterGel Pro V2 employs a demonstrably superior compound formula for outstanding thermal conductivity between the chipset and cooler base. DIRECT CONTACT COOLING TECHNOLOGY - The main heat exchanger features a perfectly flat array of 4 copper heat pipes (Ø 6mm) designed to accelerate thermal conductivity using Direct Contact technology for quick and efficient heat dissipation ZERO ELECTRICAL CONDUCTIVITY - Prevents CPU or GPU short circuiting by completely eliminating the risk of

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