Thermal Pastes & Thermal Pads

Nanometer Super Conductive Thermal Grease Paste (5.15 W/m-k) Thermal Conductivity is 2.6 W/m-K to 4.5 W/m-k High Quality, and Low thermal impedance, (Can endure paste state) Wide operation temperature range, can keep stable performance (Between -55~300°C) High Heat Dissipation Performance, and Cost-Effective

Halnziye HY810 (5g) tube Nano Thermal Grease Paste (4.63 W/m-k) for 1.4GHz+ CPU

Halnziye HY410 White Thermal Grease Paste 0.5G Slim Tube

Halnziye HY610 Gold 2g Thermal Grease Paste with Spreader for CPU Heat Transfers Thermal Conductivity: > 3,05 W/m-K - Thermal Impedance: < 0,073 °C-in²/W - Specific Gravity: > 2,48 g/cm³ Viscosity: 1000 - Thixotropic Index: 380±10 1/10mm Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +240 °C Composizione: Silicone Compound 30% - Carbon Compound 20% - Metal Oxide Compound 50%

Series: HY510 - Package type: Syringe - Content: 5g - Quantity: 1 pcs - Total Content: 5g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.225 °C-in2/W - Specific Gravity: > 2 g/cm3 Viscosity: 1000 - Thixotropic Index: 380±10 1/10 Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +280 °C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%

W conductivity resistance: > from 0.925 B/M K CPU, VGA, LED, chipset and other PC components Projection requirements in accordance with semiconductor industry directive Thermal resistance: < 0.262 & x2103. in2/W High stability and re

Thermal Conductivity: >1.93 W/mK Thermal Resistance:

Thermal Conductivity: >1.93 W/mK Thermal Resistance:

Thermal Conductivity: >1.93 W/mK Thermal Resistance:

Thermal Conductivity: >1.93 W/mK Thermal Resistance: