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Thermal Pastes & Thermal Pads

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32.89Buy!
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Thermal conductivity: 2.5 W/m-k Density: 2.5 g/cm3 Operating temperature: -40 - 150 ° Colour: Grey Kit Contents: 1 x Quick Start Guide 1 x Thermal Paste (Application Syringe) 1 x ROG Spreader 4 x more→ROG Stencils 2 x Cleaning Wipes
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73W/(m·K) THERMAL CONDUCTIVITY - Extremely high conductivity, perfect for even the most demanding configurations.
LONG ACTION - Conductonaut has high thermal conductivity and is stable even wit more→h extended use. However, it CANNOT be used on aluminum components due to the risk of corrosion.
EXEPTIONAL RESUTLS - Using this thermal compound will immediately lower temperatures, reducing equipment noise and improving user comfort.
GREAT VALUE FOR MONEY - Conductonaut is an excellent choice for experienced users who want to enhance their system's thermals, as it provides up to 10 times more thermal conductivity than other thermal greases.
1 GRAMM - useable for up to 6 CPUs (depending on diy size)
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Box contents: 5 x HY710 30 g (150 g) Thermal Conductivity: >3.17 W/m-K Thermal impedance:
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Who is this paste suitable for This high-performance thermal paste is aimed at all users, but in particular for those who want to get the last out of their high-end system. With an extreme thermal con more→ductivity of 16W/mK, this paste is clearly one of the best on the market.
Application: the processing of Alphacools Subzero Thermal Grease differs from most other thermal pastes due to optimal viscosity. For the perfect application of the paste as a thin film, the product also comes with a practical plastic spatula.
Alphacools Subzero Thermal Grease has an extremely high thermal conductivity of 16W/mK with a viscosity of 850,000 TF. This is slightly more fluid than usual to other thermal pastes …
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Series: HY510 - Package type: Syringe - Content: 30g - Quantity: 3 pcs - Total Content: 90g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.225 °C-in2/W - Specific Gravity: > 2 g/cm3 Vis more→cosity: 1000 - Thixotropic Index: 380±10 1/10 Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +280 °C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%
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Provides precise and even contact filling air gaps, Made of Non-Toxic material
Transfers heat away from VGA Card, RAM, and Notebook PC Components
Flexible material cuts smoothly and does more→n't tear, lasts for years
Operating Temp: -40C to 200C, Hardness: 55 Shore 00, Specific Gravity: 3.25g/cm3
Thermal Conductivity: 11.8 W/mK (Non-Electrically Conductive)
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Made With 99.9% Pure Silver High-Density Controlled Triple-Phase Viscosity Not Electrically Conductive Absolute Stability
The Corsair XTM70 is an extremely high-performance thermal compound and offers excellent heat transfer. It reliably keeps your high-end hardware cool without drying out or cracking. The Corsair XTM70 more→is ideal for CPUs and GPUs with extreme performance and high TDP and is electrically non-conductive.In addition to a syringe with 3g thermal paste, the packaging also includes an applicator kit that makes it easier to apply evenly to the heatspreader or chip. There are also three cleaning wipes for cleanly removing residue.Technical details:- Quantity: 3 g- Density: 2.7 g/cm³Scope of delivery:- 1x syringe with Corsair XTM70- Spplicator Kit- 3x cleaning cloth
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Average Particle Size: less than 0.49 micron less than 0.000020 inch Extended Temperature Limits: Peak: �50oC to more than 180oC Long-Term: �50oC to 130oC Performance: 3 to 12 degrees centigrade lo more→wer CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gRAM syringe contains enough compound to cover at least 15 to 25 small CPU cores or 6 to 10 large CPU cores or 2 to 5 heat plates. At a layer 0.003" thick the 3.5 gRAM syringe will cover approximately 16 square inches.
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Passive heatsink designed for Intel Optane SSD 905P M.2 Reduces thermal throttling and improves drive performance Compact design reduces interfere with other components Material: Aluminum front and more→backplates with steel clips
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Overclockers.co.uk
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Product information - AM5 High Performance Heatspreader - Replaces SAM and heat spreader - 240% larger surface area (22 cm²) - Made from nickel plated copper - Diamond milled precision surface - more→Compatible with air and water coolers For delidded CPUs only! The Thermal Grizzly AM5 High Performance Heatspreader in detail The AM5 High Performance Heatspreader is an upgrade heatspreader for AMD's Ryzen 7000 processors. The nickel-plated copper heat spreader features a 240 percent larger, precision diamond-milled surface. This increased surface area compared to the original heatspreader allows for maximum heat dissipation on both air and water coolers, while precision milling ensures extremely …
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COMPACT AIR COOLER - The 136mm low-profile Hyper H412R is ideal for high-performance CPU cooling in compact SFF motherboards or cases with limited clearance HIGH THERMAL CONDUCTIVITY – At 9 W/mK., th more→e MasterGel Pro V2 employs a demonstrably superior compound formula for outstanding thermal conductivity between the chipset and cooler base. DIRECT CONTACT COOLING TECHNOLOGY - The main heat exchanger features a perfectly flat array of 4 copper heat pipes (Ø 6mm) designed to accelerate thermal conductivity using Direct Contact technology for quick and efficient heat dissipation ZERO ELECTRICAL CONDUCTIVITY - Prevents CPU or GPU short circuiting by completely eliminating the risk of
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35.53Buy!
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Series: HY810 - Package type: Syringe - Content: 20g - Quantity: 5 pcs - Total Content: 100g Thermal Conductivity: > 4.63 W/m-K - Thermal Impedance: < 0°C-in²/W - Specific Gravity: > 3 g/cm³ Viscosi more→ty: 12500 - Thixotropic Index: 280±10 1/10 mm Moment Bore Temperature: -50 +300°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 15% - Carbon Compound 35% - Metal Oxide Compound 50%
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Designed for efficiency and reliability, the EK-Loop Thermal Paste NGP features a very low thermal impedance to ensure effective thermal conductivity and improved system performance
Optimized f more→ormula provides superior clamp-resistance and long-term stability and provides stable performance in a temperature range from -20℃ to 125℃
This high quality thermal paste features a user-friendly application. Each package contains a high quality black spatula to help you apply the perfect layer. EK-Loop Thermal Paste NGP user-friendly viscosity is easy to apply and maintains a consistent application without the risk of conductive issues
Packaged in a practical 5 gram (5 gram) syringe, the EK-Loop Ther&hellip;
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Helps disperse the heat from CPU to heatsink effectively. Suitable for: CPU, GPU ,heatsink, ovens, chipset, Xbox, High power LED and other components. High Performance! High temperature resistance, more→Non-Electrical Conductive, Non-toxic, Non-corrosive. Thermal Conductivity: >3.17W/m-k , Net Weight: 100gram Package Includes : 1 x GENNEL G107 100g Silver thermal grease paste, 1 x Thermal paste spatula
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Provides precise and even contact filling air gaps, Made of Non-Toxic material
Transfers heat away from VGA Card, RAM, and Notebook PC Components
Flexible material cuts smoothly and does more→n't tear, lasts for years
Operating Temp: -40C to 200C, Hardness: 55 Shore 00, Specific Gravity: 3.25g/cm3
Thermal Conductivity: 11.8 W/mK (Non-Electrically Conductive)
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