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Thermal Pastes & Thermal Pads

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When you require performance, reliability, and quality the PK compounds are where to turn to. The PK-Zero offers many of the same excellent benefits of the PK line, but at a budget price. It is easy t more→o apply, requires no burn-in time, has a long lifespan with low dry-out, and is not electrically conductive. The nanoparticles help to fill in microscopic imperfections in the surfaces between the heat sink and contact surface, providing leading brand thermal dissipation!Features: - Low Viscosity allows for easy application- No "burn-in" time required- Low Dry-Out- Electrically Non-Conductive- Good performance- Long-Term Stability- Non-CorrosiveSpecification:- Al > 10 (wt%) - ZnO > 50 (wt%)- Specific …
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Provides precise and even contact filling air gaps, Made of Non-Toxic material
Transfers heat away from VGA Card, RAM, and Notebook PC Components
Flexible material cuts smoothly and does more→n't tear, lasts for years
Operating Temp: -40C to 200C, Hardness: 55 Shore 00, Specific Gravity: 3.25g/cm3
Thermal Conductivity: 11.8 W/mK (Non-Electrically Conductive)
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Package contents: HALNZIYE HY410 0.5 g (2.5 g) Thermal Conductivity: >1.42W/m-K Thermal Impedance:
Thermal Grizzly spatulas are a great way to spread thermal paste evenly across delicate hardware. Suitable for watercooling, air cooling and extreme cooling and compatible with every brand of thermal paste.
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Package contents: 5x HALNZIYE HY610 0.5 g (2.5 g) Thermal Conductivity: >3.05 W/m-K Thermal Impedance:
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Series: HY510 - Package type: Syringe - Content: 30g - Quantity: 3 pcs - Total Content: 90g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.225 °C-in2/W - Specific Gravity: > 2 g/cm3 Vis more→cosity: 1000 - Thixotropic Index: 380±10 1/10 Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +280 °C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%
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Content:2.9g
Thermal Conductivity(W/m.k):14W/m.k
Thermal lmpedance (℃-cm2/W):
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High-performance thermal pad with phase change material for optimal heat transfer
Easy to use and use
Package Content: 1 x PhaseSheet PTM Heat Pad
Excellent thermal conductivity f more→or efficient cooling of CPU, GPU and other electronic components
Solid at room temperature, only liquefies from 45°C for easy application
Very low viscosity in liquid state for minimal thickness
Reduced pumping effect due to contraction during solidification
Non-electrically conductive, safe for sensitive electronics
Long-lasting performance with stable thermal conductivity after approximately 10 thermal cycles
Versatile in different cooling systems
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