Servers

ProcessorProcessor threads16Processor cache typeL3Processor cache128 MBProcessor frequency3.2 GHzProcessor boost frequency3.4 GHzNumber of processors installed1Processor model7262Processor cores8Processor manufacturerAMDProcessor familyAMD EPYCMemoryInternal memory16 GBMemory layout (slots x size)1 x 16 GBMemory slots16x DIMMMemory clock speed2933 MHzMaximum internal memory1.02 TBInternal memory typeDDR4-SDRAMStorageRAID supportYesRAID levels0, 5, 10Optical drive typeNoNumber of HDDs supported4M

ProcessorBuilt-in processorNoProcessor socketSocket SP3Processor familyAMD EPYCNumber of processors supported2Motherboard chipsetAMD SoCProcessor manufacturerAMDMemorySupported RDIMM clock speeds3200 MHzSupported memory typesDDR4-SDRAMNumber of DIMM slots32Maximum RDIMM memory4.1 TBStorageNumber of storage drives supported8Supported storage drive interfacesSerial ATA, Serial Attached SCSI (SAS)Storage drive sizes supported2.5"Supported storage drive typesHDD & SSDPorts & interfacesU

ProcessorBuilt-in processorNoProcessor socketSocket SP3Processor familyAMD EPYCNumber of processors supported2Motherboard chipsetAMD SoCProcessor manufacturerAMDMemorySupported RDIMM clock speeds3200 MHzSupported memory typesDDR4-SDRAMNumber of DIMM slots32Maximum RDIMM memory4.1 TBStorageNumber of storage drives supported8Supported storage drive interfacesSerial ATA, Serial Attached SCSI (SAS)Storage drive sizes supported2.5"Supported storage drive typesHDD & SSDPorts & interfacesU

ProcessorBuilt-in processorNoProcessor socketSocket SP3Processor familyAMD EPYCNumber of processors supported2Motherboard chipsetAMD SoCProcessor manufacturerAMDMemorySupported RDIMM clock speeds3200 MHzSupported memory typesDDR4-SDRAMNumber of DIMM slots32Maximum RDIMM memory4.1 TBStorageNumber of storage drives supported8Supported storage drive interfacesSerial ATA, Serial Attached SCSI (SAS)Storage drive sizes supported2.5"Supported storage drive typesHDD & SSDPorts & interfacesU

Powered by Intel Xeon Scalable Platform to pack incredible power into minimal space, 24 DIMM slots provide best-in-class memory capacity and bandwidth, and an integrated I/O controller on the processor eliminates data transfer bottlenecks caused by discrete I/O chipsets for reduced latency and dramatically faster system performance Expansion Storage for Faster Transfer Speeds features a port-to-port OCuLink design with 3X faster transfer speeds compared to PCIe switch IC solutions. Two M.2 slots accommodate 22110-size SSDs with support for additional OS storage and PCIe 3.0 x4 bandwidth — 5.3X faster than 6 Gb/s SATA III — for faster boot speeds Advanved I/O support for 3 + 1 Expandability offe…

12 x 2.5"drive bays in 1U, the highest capacity storage on the market High expandability for storage and communication Flexible storage with dual M.2 Release the power of AMD EPYC™ 7002 processor Best-in-class memory bandwidth and capacity Comprehensive IT Infrastructure Management Software Smart thermal design for energy efficiency Server Fan Control AMD EPYC™ 7002 platform 1U server with 12 2.5" storage bays12 x 2.5"drive bays in 1U, the highest capacity storage on the marketRS700A-E9-RS12V2 fits up to 12 2.5-inch storage drives in a compact 1U form factor. With support for multiple drive configurations, including eight NVMe and four SATA drives, four NVMe and eight SATA drives, or four NVME…

ProcessorProcessor generation1st Generation Intel® Xeon® ScalableThermal Design Power (TDP)85 WTcase77 °CSteppingU0Scalability2SProcessor threads8Processor package size76.0 x 56.5 mmProcessor operating modes64-bitProcessor lithography14 nmProcessor codenameSkylakeProcessor codeSR3GLMemory types supported by processorDDR4-SDRAMMemory clock speeds supported by processor2133 MHzMemory channels supported by processorHexaMaximum number of PCI Express lanes48Maximum internal memory supported by proces

Powered by AMD EPYC 7003 processor with 64 cores, 128 threads and support for a maximum TDP of up to 280 watts per socket Up to 12 all-flash NVMe drives on front panel and four drives on middle panel to enable extensive storage and high-throughput performance Up to three PCIe® 4.0 slots to enable higher bandwidth and improved data-transfer rates Onboard ASUS ASMB10-iKVM for out-of-band management with ASPEED AST2600 controller Integrated PFR FPGA as the platform Root-of-Trust solution for firmware resiliency Air cooling with heatsink achieves lower power-usage effectiveness (PUE) and optimized TCO for data centers New tool-less design for easy serviceability AMD EPYC 7003 Series ProcessorsThe l…

No OS Intel Xeon E-2414 (12MB Cache, 2.6GHz) 16GB DDR5-SDRAM & 480GB SSD iDRAC9, Enterprise 16G Processing performance, GPU supportThe 1U, single-socket PowerEdge R360 is an entry-level rack server for customers desiring versatility, affordability, and processing power. Processor Processor threads 4 Thermal Design Power (TDP) 55 W Number of processors installed 1 Motherboard chipset Intel C262 Processor cache 12 MB Processor cores 4 Performance cores 4 Processor boost frequency 4.5 GHz Processor frequency 2.6 GHz Processor model E-2414 Processor family Intel Xeon E Processor manufacturer Intel Memory Maximum internal memory 128 GB Memory data transfer rate 5600 MT/s ECC Yes Buffered memory type …

Intel Xeon E-2224 (8MB Cache, 3.4GHz) 16GB (2666MHz) DDR4-SDRAM (1 x 16) Enterprise-quality tower serverA 1S tower server featuring the latest Intel® Xeon® E-2200 processor, the ThinkSystem ST250 features enterprise compute and storage paired with office-quiet acoustics. The ThinkSystem ST250 is ideal for the retail application, branch office, or environment that may lack dedicated data center real estate, with Lenovo XClarity management offering a seamless IT administrative experience.Enterprise capacityThe Thinksystem ST250 harnesses enterprise-level server power with the next-generation Intel® Xeon® E-2200 processors, featuring a performance bump of up to 34% generation-to-generation,

Rack (2U) 4 fan(s) Intel® C612 LGA 2011-v3 Number of processors supported: 2 Number of DIMM slots: 24 Number of storage drives supported: 24 Hot-swap HDD bays Number of 2.5" bays: 24 Ethernet LAN USB 2.0 ports quantity: 2 Ethernet LAN (RJ-45) ports: 3 1600 W Black, Grey Processor Intel Xeon series E5-2600 Compatible processor series Intel® Xeon® Number of processors supported 2 Processor socket LGA 2011-v3 Motherboard chipset Intel® C612 Built-in processor No Memory Memory voltage 1.2 V Supported RDIMM clock speeds 1600,1866,2133,2400 MHz Supported DIMM module capacities 32GB, 64GB, 128MB Supported memory types DDR4-SDRAM Number of DIMM slots 24 Storage Supported storage drive interfaces Seri…

ProcessorBuilt-in processorNoNumber of processors supported2

Poweredby the latest 2nd Gen Intel Xeon Scalable processors withIndustry-leading 2TB memory capability 205W CPU with 16 DIMMs support 8 x 3.5” Hot-Swap HDD Bays (4x NVMe Supported) Comprehensive IT infrastructure management solution - ASMB9-iKVM and ASUS Control Center (ACC) Thermal Radar and Auto Fan Control Rack-optimized Design 6 PCIe + 1 OCP Expansion Slots in 2U Dual M.2 Support OCP 2.0 Mezzanine Industry-leading memory capabilityWith 16 RAM slots that support up to 2TB of fast, DDR4-2933MHz 3DS ECC RDIMMs or LRDIMMs, ASUS RS520-E9-RS8 V2 delivers industry-leading memory capability for your business.The best storage interface combination for software-defined storage management8 x 3.5" / …

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Powered by AMD EPYC 7003 processor with 64 cores, 128 threads and support for a maximum TDP of up to 280 watts per socket GPU-optimized design allows two dual-slot or four single-slot GPUs for AI workloads A total of 12 storage bays in combination of NVMe/SATA/SAS drives on front panel, and 6 direct more on middle and rear panels enable extensive storage and high-throughput performance Up to five PCIe® 4.0 slots to enable higher bandwidth and improved data-transfer rates Onboard ASUS ASMB10-iKVM for out-of-band management with ASPEED AST2600 controller Integrated PFR FPGA as the platform Root-of-Trust solution for firmware resiliency Air cooling with heatsink achieves lower power-usage effectiveness (…

Compatible with 3 x NVIDIA Tesla® PCIe GPU cards Single AMD EPYC™ 7002 series processor family 8-Channel RDIMM/LRDIMM DDR4, 8 x DIMMs 2 x 1Gb/s LAN ports (Intel® I350-AM2) 1 x Dedicated management port 6 x 2.5" SATA and 4 x 2.5 NVMe hot-swappable HDD/SSD bays Ultra-Fast M.2 with PCIe Gen3 x4 interface 3 x PCIe x16 expansion slots 1 x OCP 2.0 Gen3 x16 mezzanine slots Aspeed® AST2500 remote management controller 1200W 80 PLUS Platinum redundant PSU AMD EPYC™ 7002 Series Processor (Rome)The next generation of AMD EPYC has arrived, providing incredible compute, IO and bandwidth capability – designed to meet the huge demand for more compute in big data analytics, HPC and cloud computing.- Built o…

Hard driveRAID levels0, 1, 5, 10Hot-swap HDD baysYesOptical driveOptical drive typeNoManagement featuresPC health monitoringCPU, Fan, LED, TemperatureIntelligent Platform Management Interface (IPMI) supportYesProcessorSystem bus rate8 GT/sProcessor socketLGA 2011 (Socket R)Processor familyIntelNumber of processors supported2Motherboard chipsetIntel® C602Intel Xeon seriesE5-2600Compatible processor seriesIntel® Xeon®Motherboard southbridgeIntel ICH10RDesign80 PLUS certification80 PLUS PlatinumLED

Rack (1U) Intel® C624 LGA 3647 (Socket P) Number of processors supported: 2 Number of DIMM slots: 24 Maximum internal memory: 7.5 TB Number of storage drives supported: 6 Hot-swap HDD bays Number of 3.5" bays: 4 Ethernet LAN Ethernet LAN (RJ-45) ports: 3 1100 W Black, Silver Intel® Virtualization Technology for Directed I/O (VT-d)Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.TPM

Socket E (LGA4677) support Intel® Xeon® W-3400 processors Intel® W790 16 DIMMs 1x 1GbBaseT, 1x 10GbBaseT 2 2.5" SATA3 drive bays; 4 3.5" SATA3 drive bays; ; 4 M.2 NVMe 1 120 mm Fan(s) ; 2 120 mm Fan(s) 2000W Power Supplies Platinum Level (%+) Processor Intel Xeon series X3400 Compatible processor series Intel® Xeon® Processor socket LGA 4677 (Socket E) Motherboard chipset Intel W790 Built-in processor No Memory Memory voltage 1.1 V Maximum internal memory 2 TB Supported memory types DDR5-SDRAM Number of DIMM slots 16 Storage Storage drive sizes supported 3.5,5.25" Number of 3.5" bays 4 Hot-swap HDD bays No Number of storage drives supported 6 Network LAN controller Intel® I210-AT,

Does your data center need a secure, performance driven dense server that you can confidently deploy for virtualization, database, or high-performance computing? The HPE ProLiant DL360 Gen10 server delivers security, agility and flexibility without compromise.

Powerful performance:Powered by AMD EPYC 9004 processors with 128 Zen 4c cores, 12-channel, up to 4800 MHz DDR5 and support for a maximum TDP of up to 400 watts Scale-up storage and expansion design:Up to 4 all-flash NVMe drives on the front panel and 3 PCIe 5.0 slots for higher bandwidth and system upgrade Flexible networking module design:On-board LAN module, and OCP 3.0 module with PCIe 5.0 slot in rear panel for faster connectivity Advanced air cooling solution: Features enhanced volume air cooling (EVAC) heatsink for processors with higher TDP Enhanced IT-infrastructure management:ASUS ASMB11-iKVM remote control with ASPEED AST2600, ASUS Control Center IT management software and hardware-level …

Intel Xeon E E-2224 3.4 GHz 16 GB 2666 MHz DDR4-SDRAM DVD±RW Tower (4U) 550 W Enterprise-quality tower serverA 1S tower server featuring the latest Intel® Xeon® E-2200 processor, the ThinkSystem ST250 features enterprise compute and storage paired with office-quiet acoustics. The ThinkSystem ST250 is ideal for the retail application, branch office, or environment that may lack dedicated data center real estate, with Lenovo XClarity management offering a seamless IT administrative experience.Enterprise capacityThe Thinksystem ST250 harnesses enterprise-level server power with the next-generation Intel® Xeon® E-2200 processors, featuring a performance bump of up to 34%

ProcessorProcessor generation1st Generation Intel® Xeon® ScalableThermal Design Power (TDP)85 WTcase77 °CSteppingU0Scalability2SProcessor threads8Processor package size76.0 x 56.5 mmProcessor operating modes64-bitProcessor lithography14 nmProcessor codenameSkylakeProcessor codeSR3GLMemory types supported by processorDDR4-SDRAMMemory clock speeds supported by processor2133 MHzMemory channels supported by processorHexaMaximum number of PCI Express lanes48Maximum internal memory supported by proces