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Akasa AK-T505-5G T5 Essential Thermal Compound Syringe, 5g, Grey, Low Thermal Resistance, Non-Curing, Non-Electrically

Photos - Thermal Paste Akasa AK-T505-5G T5 Essential Thermal Compound Syringe, 5g, Grey, Low Thermal Resistance, Non-Curing, Non-Electrically
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Akasa AKASA AK-T505-5G T5 Essential Thermal Compound Syringe, 5g, Grey, Low Thermal Resistance, Non-Curing, Non-Electrically

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Akasa AK-T505-5G T5 Essential Thermal Compound Syringe, 5g, Grey, Low Thermal Resistance, Non-Curing, Non-Electrically
£10.00 

Buy Akasa AK-T505-5G T5 Essential Thermal Compound Syringe, 5g, Grey, Low Thermal Resistance, Non-Curing, Non-Electrically

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Akasa AKASA AK-T505-5G T5 Essential Thermal Compound Syringe, 5g, Grey, Low Thermal Resistance, Non-Curing, Non-Electrically

T5 EssentialEasily apply hi-performance thermal paste to your CPU and GPU, developed for higher thermal conductivity. Perfect for standard systems with 10-20 applications.- Low thermal resistance for hi-heat transfer- Non-curing and non-electrically conductive properties- Conveniently included wipes and spreaderLow Thermal Resistance for Hi-Heat Tr... moreansferHeat can easily be transferred from CPU or GPU to heatsink due to its low thermal resistance for efficient performance. Getting the most out of your CPU and air/liquid heatsink cooler.Easy and Safe ApplicationNon-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.Conveniently Included Wipes and SpreaderEasy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean oldpaste to make sure a good bond is established with heatsink.ApplicationThermally conductive compoundThermal Conductivity4.0 W/mKSpecific Gravity2.6FormNon-curing compoundOperating Temperature-50°C to 220°CThermal Resistance0.07°C-cm²/W @ 60 psiColourGreyViscosity4,800,000 (mPa.s/ 22°C)Weight5g
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£9.99
T5 EssentialEasily apply hi-performance thermal paste to your CPU and GPU, developed for higher thermal conductivity. Perfect for standard systems with 10-20 applications.- Low thermal resistance for hi-heat transfer- Non-curing and non-electrically conductive properties- Conveniently included wipes and spreaderLow Thermal Resistance for Hi-Heat TransferHeat can easily be transferred from CPU or GPU to heatsink due to its low thermal resistance for efficient performance. Getting the most out of your CPU and air/liquid heatsink cooler.Easy and Safe ApplicationNon-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.Conveniently Included Wipes and SpreaderEasy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean oldpaste to make sure a good bond is established with heatsink.ApplicationThermally conductive compoundThermal Conductivity4.0 W/mKSpecific Gravity2.6FormNon-curing compoundOperating Temperature-50°C to 220°CThermal Resistance0.07°C-cm²/W @ 60 psiColourGreyViscosity4,800,000 (mPa.s/ 22°C)Weight5g
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