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Thermal Pastes & Thermal Pads Halnziye

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Thermal Paste Halnziye HY-T1 2g
thermal Paste, 2 g, thermal conductivity 8.3 W/mK, scraper

Thermal Paste Halnziye HY-881 2g
thermal Paste, 2 g, thermal conductivity 5.6 W/mK, scraper

Thermal Paste Halnziye HY-880 15g
thermal Paste, 15 g, thermal conductivity 5.15 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-810 2g
thermal Paste, 2 g, thermal conductivity 4.63 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-710 5g
thermal Paste, 5 g, thermal conductivity 3.17 W/mK, operating temperature -30 — 240 °С, no scraper

Thermal Paste Halnziye HY-710 30g
thermal Paste, 30 g, thermal conductivity 3.17 W/mK, operating temperature -30 — 240 °С, no scraper

Thermal Paste Halnziye HY-710 2g
thermal Paste, 2 g, thermal conductivity 3.17 W/mK, operating temperature -30 — 240 °С, no scraper

Thermal Paste Halnziye HY-710 1g
thermal Paste, 1 g, thermal conductivity 3.17 W/mK, operating temperature -30 — 240 °С, no scraper

Thermal Paste Halnziye HY-610 3g
thermal Paste, 3 g, thermal conductivity 3.05 W/mK, operating temperature -30 — 240 °С, no scraper

Thermal Paste Halnziye HY-610 30g
thermal Paste, 30 g, thermal conductivity 3.05 W/mK, operating temperature -30 — 240 °С, no scraper

Thermal Paste Halnziye HY-610 2g
thermal Paste, 2 g, thermal conductivity 3.05 W/mK, operating temperature -30 — 240 °С, no scraper

Thermal Paste Halnziye HY-510 3g
thermal Paste, 3 g, thermal conductivity 1.93 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-510 30g
thermal Paste, 30 g, thermal conductivity 1.93 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-410 5g
thermal Paste, 5 g, thermal conductivity 1.42 W/mK, operating temperature -30 — 280 °С, no scraper

Thermal Paste Halnziye HY-410 30g
thermal Paste, 30 g, thermal conductivity 1.42 W/mK, operating temperature -30 — 280 °С, no scraper

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20g Gold Silicone Compound Thermal Grease Paste for PC CPU Heatsink Chipset VGA GPU Ovens Cooling
2.55Buy!
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Series: HY510 - Package type: Syringe - Content: 5g - Quantity: 1 pcs - Total Content: 5g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.225 °C-in2/W - Specific Gravity: > 2 g/cm3 Visco more→sity: 1000 - Thixotropic Index: 380±10 1/10 Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +280 °C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%
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Dimensions (H x W): 5 x 5 cm Thickness: 2 mm Thermal Conductivity: 2.0W/m-K Thermal impedance: 0.18~0.25°C-in^2/W Colour: grey
14.72Buy!
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Dimensions (H x W): 5 x 5 cm Thickness: 2 mm Thermal Conductivity: 4.0W/m-K Thermal impedance:
12.65Buy!
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Dimensions: 5 x 5 cm (h x w) Thickness: 1 mm Thermal Conductivity: 2.0W/m-K Thermal impedance: 0.18~0.25°C-in^2/W Colour: grey
13.26Buy!
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Dimensions (H x W): 5 x 5 cm Thickness: 1 mm Thermal Conductivity: 4.0W/m-K Thermal impedance:
12.98Buy!
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Dimensions (H x W): 5 x 5 cm Thickness: 0.5 mm Thermal Conductivity: 3.0W/m-K Thermal impedance:
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Dimensions: 15 x 15 cm (height x width) Thickness: 1 mm Thermal Conductivity: 3.0W/m-K Thermal impedance:
18.91Buy!
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Dimensions: 15 x 15 cm (height x width) Thickness: 1 mm Thermal Conductivity: 4.0W/m-K Thermal impedance:
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