The information in the model description is for reference purposes. Always clarify the specifications and configuration of the product with the online store manager before purchasing. Catalog ARCTIC 2025 - new arrivals, bestsellers, and the most relevant models ARCTIC.
Buy ARCTIC TP-3 120x20x1.0mm (4-pack)
When you make a purchase through links on our site, we may receive a affiliate commission.
ARCTIC TP-3 Premium Performance Thermal Pad 120 x 20 mm, 1 mm ACTPD00056A
ARCTIC TP-3 Premium Performance Thermal Pad 120 x 20 mm 1 mm ACTPD00056A
High Performance — Very Soft Based on silicone and a special filler TP-3 outperforms high-performance pads especially when height differences of closely spaced chips typically occur due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite extremely low hardness.
Minimization of Ther... moremal Resistance The thinner the pad the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness the installation of the 0.5 mm pad requires extra care. Please refer to the user manual.
Versatile Applications Heat-conducting vibration-damping mouldable electrically insulating — safe and easy to use. Thanks to its good compression properties the soft heat conduction pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard format for M.2 the TP-3 is available in various sizes and thicknesses which can be easily cut to the desired shape and size. This makes it ideal for RAMs chipsets and ICs of all kinds which are used in PCs laptops consoles graphics cards and electronic devices in general.
Safe Handling The ARCTIC TP-3 is electrically insulating non-adhesive and easy to handle. This means that optimal and safe heat transfer can be ensured in many application areas.
Bridging Gaps The TP-3 is softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances. Thanks to their good compressibility properties the thermal pads act as the perfect gap filler and bridge uneven surface and air gaps without stressing sensitive and protruding components.