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Thermal Pastes & Thermal Pads

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13.36Buy!
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Dimensions (H x W): 5 x 5 cm Thickness: 1 mm Thermal Conductivity: 4.0W/m-K Thermal impedance:
13.01Buy!
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Dimensions (H x W): 5 x 5 cm Thickness: 0.5 mm Thermal Conductivity: 3.0W/m-K Thermal impedance:
17.32Buy!
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Dimensions: 15 x 15 cm (height x width) Thickness: 1 mm Thermal Conductivity: 3.0W/m-K Thermal impedance:
18.94Buy!
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Dimensions: 15 x 15 cm (height x width) Thickness: 1 mm Thermal Conductivity: 4.0W/m-K Thermal impedance:
16.30Buy!
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Dimensions: 15 x 15 cm (height x width) Thickness: 1.5 mm Thermal Conductivity: 2.0W/m-K Thermal impedance: 0.18~0.25°C-in^2/W Colour: grey
13.20Buy!
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Dimensions: 10 x 10 cm (height x width) Thickness: 0.5 cm Thermal Conductivity: 2.0W/m-K Thermal impedance: 0.18~0.25°C-in^2/W Colour: grey
14.86Buy!
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Dimensions: 10 x 10 cm (height x width) Thickness: 0.5 mm Thermal Conductivity: 4.0W/m-K Thermal impedance:
27.55Buy!
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3 Arctic Silver Paste Thermal
20.30Buy!
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Premium silver polysynthetic thermal compound Use between CPU's and heatsinks or water-cooling solutions Will not separate, run, migrate, or bleed Does not contain any silicone 3.5 gram tube will more→cover 20 to 30 small cpu's
11.35Buy!
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Arctic Silver Alumina Color: White
42.17Buy!
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Made With 99.9% Pure Silver High-Density Controlled Triple-Phase Viscosity Not Electrically Conductive Absolute Stability
55.46Buy!
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3.79Buy!
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100g tub for industrial use Nano-Carbon Thermal Grease (Paste), silicon base 3.17 W/m-k Low thermal impedance Wide operation temperature range of 55~300°C High heat dissipation performance
7.66Buy!
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Thermal paste for processors and repair of computer components or video game consoles in general. Solves temperature and shutdown issues of PC and other devices For CPU, VGA, chipset, radiator and ot more→her PC components Helps efficiently disperse heat from CPU to heatsink To ensure the stability of electronic instruments, meters and other electrical performance Low thermal resistance and high conductivity for superior heat transfer
12.74Buy!
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Specifications: Size: 75 x 22.7 x 11.7 mm, body material: aluminium alloy, colour: silver grey Fine workmanship: heat sink made of aluminium / anode sand blasting process / 2280 specifications / doub more→le-layer silicone film Durable: the oxidation of alloy aluminium significantly improves corrosion resistance, hardness, wear resistance, insulation, heat resistance of the cooler and extends the service life Applicable type: M.2 interface 22 x 80 mm specification SSD, partially compatible with M.2 2260/2242 specification SSD 【High Performance】Cool your M.2 2280 SSD with a cooling effect of 10°C - 20°C (varies depending on environment) to a safe temperature to avoid overheating, and improve the pe…
5.58Buy!
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Type: thermal paste Power: High (12 W/mK) Consistency: pastous
32.94Buy!
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Thermal conductivity: 2.5 W/m-k Density: 2.5 g/cm3 Operating temperature: -40 - 150 ° Colour: Grey Kit Contents: 1 x Quick Start Guide 1 x Thermal Paste (Application Syringe) 1 x ROG Spreader 4 x more→ROG Stencils 2 x Cleaning Wipes
32.75Buy!
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COMPACT AIR COOLER - The 136mm low-profile Hyper H412R is ideal for high-performance CPU cooling in compact SFF motherboards or cases with limited clearance HIGH THERMAL CONDUCTIVITY – At 9 W/mK., th more→e MasterGel Pro V2 employs a demonstrably superior compound formula for outstanding thermal conductivity between the chipset and cooler base. DIRECT CONTACT COOLING TECHNOLOGY - The main heat exchanger features a perfectly flat array of 4 copper heat pipes (Ø 6mm) designed to accelerate thermal conductivity using Direct Contact technology for quick and efficient heat dissipation ZERO ELECTRICAL CONDUCTIVITY - Prevents CPU or GPU short circuiting by completely eliminating the risk of
3.05Buy!
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Series: HY880 - Package type: Syringe - Content: 5g - Quantity: 1 pcs - Total Content: 5g Thermal Conductivity: > 5.15 W/m-K - Thermal Impedance: < 0°C-in²/W - Specific Gravity: > 3 g/cm³ Viscosity: more→12500 - Thixotropic Index: 280±10 1/10 mm Moment Bore Temperature: -50 +340°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 10% - Carbon Compound 45% - Metal Oxide Compound 45%
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