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Thermal Pastes & Thermal Pads

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Thermal paste for processors and repair of computer components or video game consoles in general. Solves temperature and shutdown issues of PC and other devices For CPU, VGA, chipset, radiator and ot more→her PC components Helps efficiently disperse heat from CPU to heatsink To ensure the stability of electronic instruments, meters and other electrical performance Low thermal resistance and high conductivity for superior heat transfer
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High Thermal Conductivity High Compressibility Provides Electrical Insulation
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Specifications: Size: 75 x 22.7 x 11.7 mm, body material: aluminium alloy, colour: silver grey Fine workmanship: heat sink made of aluminium / anode sand blasting process / 2280 specifications / doub more→le-layer silicone film Durable: the oxidation of alloy aluminium significantly improves corrosion resistance, hardness, wear resistance, insulation, heat resistance of the cooler and extends the service life Applicable type: M.2 interface 22 x 80 mm specification SSD, partially compatible with M.2 2260/2242 specification SSD 【High Performance】Cool your M.2 2280 SSD with a cooling effect of 10°C - 20°C (varies depending on environment) to a safe temperature to avoid overheating, and improve the pe…
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Thermal conductivity: 2.5 W/m-k Density: 2.5 g/cm3 Operating temperature: -40 - 150 ° Colour: Grey Kit Contents: 1 x Quick Start Guide 1 x Thermal Paste (Application Syringe) 1 x ROG Spreader 4 x more→ROG Stencils 2 x Cleaning Wipes
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Series: HY880 - Package type: Syringe - Content: 5g - Quantity: 1 pcs - Total Content: 5g Thermal Conductivity: > 5.15 W/m-K - Thermal Impedance: < 0°C-in²/W - Specific Gravity: > 3 g/cm³ Viscosity: more→12500 - Thixotropic Index: 280±10 1/10 mm Moment Bore Temperature: -50 +340°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 10% - Carbon Compound 45% - Metal Oxide Compound 45%
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Thermal Conductivity: >3.17 W/mK Thermal Resistance:
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Box contents: 5 x HY710 30 g (150 g) Thermal Conductivity: >3.17 W/m-K Thermal impedance:
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Halnziye HY610 Gold 2g Thermal Grease Paste with Spreader for CPU Heat Transfers Thermal Conductivity: > 3,05 W/m-K - Thermal Impedance: < 0,073 °C-in²/W - Specific Gravity: > 2,48 g/cm³ Viscosity: more→1000 - Thixotropic Index: 380±10 1/10mm Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +240 °C Composizione: Silicone Compound 30% - Carbon Compound 20% - Metal Oxide Compound 50%
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Series: HY410 - Package type: Syringe - Content: 5g - Quantity: 1 pcs - Total Content: 5g Thermal Conductivity: > 1.42 W/m-K - Thermal Impedance: < 0.3 ° C-in²/W - Specific Gravity: > 2.0 g/cm³ Visc more→osity: 1000 - Thixotropic Index: 380±10 1/10 mm Moment Bore Temperature: -50 +300°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 10% - Carbon Compound 45% - Metal Oxide Compound 45%
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Helps disperse the heat from CPU to heatsink effectively. Suitable for: CPU, GPU ,heatsink, ovens, chipset, Xbox, High power LED and other components. High Performance! High temperature resistance, more→Non-Electrical Conductive, Non-toxic, Non-corrosive. Thermal Conductivity: >3.17W/m-k , Net Weight: 100gram Package Includes : 1 x GENNEL G107 100g Silver thermal grease paste, 1 x Thermal paste spatula
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Tri-linear ceramic content Electrical insulator Polysynthetic suspension fluid
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Package Content: 1x Thermal Paste, 1x Spatula Pitch, 1x Scraper, 1x Cleaning Cloth Thermal Conductivity: 11 W/m-K Specific Gravity Color: Grey Apply to CPU, VGA, LED, Chipset, Radiator and other P more→C Components
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Colour: Multi-Coloured Excellent quality products ThermalGrizzlyPastaTermicaConductonaut1gr 24 Months
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