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Gelid Solutions GC-4-1g Thermal Compound for Heat Sinks Highest Thermal Conductivity Easy to Use Non-Corrosive TC-GC-04-A

Photos - Thermal Paste Gelid Solutions GC-4-1g Thermal Compound for Heat Sinks Highest Thermal Conductivity Easy to Use Non-Corrosive TC-GC-04-A
Expecting restock
Gelid Solutions GC-4-1g Thermal Compound for Heat Sinks Highest Thermal Conductivity Easy to Use Non-Corrosive TC-GC-04-A
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BUILT FOR EXTREME USE: GC4 achieves the best thermal conductivity for your CPU or graphics card
MAXIMUM THERMAL CONDUCTIVITY: ensures exceptional heat dissipation and supports the stability needed to push the system to the desired limit
EASY AND SAFE APPLICATION: Thanks to the GELID Applicator, it can be applied easily and safely on the CPU
OPERATING TEMPERATURE: operates between -30° and +150°C
DENSITA': la pasta ha una densità di 2,30 g/cm³. Contenuto siringa: 1g
The product description is generated based on data from online stores. Before purchasing be sure to verify all information directly with the seller.

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Thermal Paste Gelid Solutions GC-4-1g Thermal Compound for Heat Sinks Highest Thermal Conductivity Easy to Use Non-Corrosive TC-GC-04-A
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