Gelid Solutions GC-4-10g for Heat Sinks Maximum Thermal Cond
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Ultimate Heat Conductivity To provide the best thermal interface and to achieve ultra-efficient heat transfer from you CPU, GP and Chipset in mission critical applications.
Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C
Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity.
Ultra-Durable & Non-Curing Stable performance under a wide range of temperatures, ranging from -30 to 150 C
Ensure ultimate conductivity GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to endure ultimate conductivity. perfect gap filling and optimal viscosity.
Product description is based on database from online stores. Be sure to verify all information directly with seller before purchasing.
