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Thermal Pastes & Thermal Pads

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19.24Buy!
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Dimensions: 15 x 15 cm (height x width) Thickness: 1 mm Thermal Conductivity: 4.0W/m-K Thermal impedance:
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Dimensions: 10 x 10 cm (height x width) Thickness: 0.5 cm Thermal Conductivity: 2.0W/m-K Thermal impedance: 0.18~0.25°C-in^2/W Colour: grey
27.80Buy!
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3 Arctic Silver Paste Thermal
21.23Buy!
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Premium silver polysynthetic thermal compound Use between CPU's and heatsinks or water-cooling solutions Will not separate, run, migrate, or bleed Does not contain any silicone 3.5 gram tube will more→cover 20 to 30 small cpu's
37.34Buy!
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Made With 99.9% Pure Silver High-Density Controlled Triple-Phase Viscosity Not Electrically Conductive Absolute Stability
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Contains 99.9% pure silver Arctic Silver 5 contains over 88% thermally Conductive filler by weight Not Electrically Conductive
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Average Particle Size: less than 0.49 micron less than 0.000020 inch Extended Temperature Limits: Peak: �50oC to more than 180oC Long-Term: �50oC to 130oC Performance: 3 to 12 degrees centigrade lo more→wer CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core. Coverage Area: A 3.5 gRAM syringe contains enough compound to cover at least 15 to 25 small CPU cores or 6 to 10 large CPU cores or 2 to 5 heat plates. At a layer 0.003" thick the 3.5 gRAM syringe will cover approximately 16 square inches.
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Easy to install, dimensions 85 x 45 x 3. 0 mm, the thermal pads can be cut ly according to your needs, perfect to fill contact surfaces gap Excellent thermal conductivity. Improved thermal silica gel more→material with 14.8 W/mk thermal conductivity, heat pad significantly improves the heat transfer between the electronic elements Plasticity. Good elasticity and compression properties, contact with electrical conductors would not cause damage of any kind A pad is versatile, insulated and non-conductive, it is safe to use, used for graphics card memory north and south bridge, RDRAM memory module, communication equipment, SSD hard disk, game console equipment, car control unit Customer service …
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Thermal conductivity: 2.5 W/m-k Density: 2.5 g/cm3 Operating temperature: -40 - 150 ° Colour: Grey Kit Contents: 1 x Quick Start Guide 1 x Thermal Paste (Application Syringe) 1 x ROG Spreader 4 x more→ROG Stencils 2 x Cleaning Wipes
28.13Buy!
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COMPACT AIR COOLER - The 136mm low-profile Hyper H412R is ideal for high-performance CPU cooling in compact SFF motherboards or cases with limited clearance HIGH THERMAL CONDUCTIVITY – At 9 W/mK., th more→e MasterGel Pro V2 employs a demonstrably superior compound formula for outstanding thermal conductivity between the chipset and cooler base. DIRECT CONTACT COOLING TECHNOLOGY - The main heat exchanger features a perfectly flat array of 4 copper heat pipes (Ø 6mm) designed to accelerate thermal conductivity using Direct Contact technology for quick and efficient heat dissipation ZERO ELECTRICAL CONDUCTIVITY - Prevents CPU or GPU short circuiting by completely eliminating the risk of
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Nanometer Super Conductive Thermal Grease Paste (5.15 W/m-k) Thermal Conductivity is 2.6 W/m-K to 4.5 W/m-k High Quality, and Low thermal impedance, (Can endure paste state) Wide operation temperat more→ure range, can keep stable performance (Between -55~300°C) High Heat Dissipation Performance, and Cost-Effective
2.85Buy!
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Nanometer Super Conductive Thermal Grease Paste (5.15 W/m-k) Thermal Conductivity is 2.6 W/m-K to 4.5 W/m-k High Quality, and Low thermal impedance, (Can endure paste state) Wide operation temperat more→ure range, can keep stable performance (Between -55~300°C) High Heat Dissipation Performance, and Cost-Effective
4.25Buy!
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Halnziye HY810 30g Ultra High Performance Nano Thermal Grease Paste for i3/i5/i7
3.89Buy!
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Thermal Conductivity: >3.17 W/mK Thermal Resistance:
34.45Buy!
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Box contents: 5 x HY710 30 g (150 g) Thermal Conductivity: >3.17 W/m-K Thermal impedance:
2.55Buy!
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Halnziye HY610 Gold 2g Thermal Grease Paste with Spreader for CPU Heat Transfers Thermal Conductivity: > 3,05 W/m-K - Thermal Impedance: < 0,073 °C-in²/W - Specific Gravity: > 2,48 g/cm³ Viscosity: more→1000 - Thixotropic Index: 380±10 1/10mm Moment Bore Temperature: -50 +280 °C - Operation Temperature: -30 +240 °C Composizione: Silicone Compound 30% - Carbon Compound 20% - Metal Oxide Compound 50%
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Series: HY510 - Package type: Syringe - Content: 30g - Quantity: 1 pcs - Total Content: 30g Thermal Conductivity: > 1.93 W/m-K - Thermal Impedance: < 0.2 ° C-in²/W - Specific Gravity: > 2.0 g/cm³ Vi more→scosity: 1000 - Thixotropic Index: 380±10 1/10 mm Moment Bore Temperature: -50 +280°C - Operation Temperature: -30 +280°C Composition: Silicone Compound 50% - Carbon Compound 30% - Metal Oxide Compound 20%
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