Computer Cooling Thermal Grizzly

TG Shield was specially developed to protect sensitive components such as the components around the CPU or GPU die. The paint reliably insulates against liquids and electricity . So you don't have to worry about damage or short circuits when applying liquid metal or other electrically conductive heat transfer agents.The protective varnish has been optimized for quick drying and only takes 30 minutes to fully cure at 20 degrees room temperature. The integrated brush enables precise and easy application.The content of 5 ml is for about 10 to 20 applicationssufficient, depending on the size of the CPU or GPU. The high application temperature of -20 ° C to 110 ° C enables use on all common CPUs an…

Suitable for all Thermal Grizzly pastes: Aeronaut, HYDRONAUT, KRYONAUT and KRYONAUT EXTREME
This thermal paste applicator allows for an even and precise distribution of the paste on the processor without risk of introducing contamination
Correct thermal paste application is essential to achieve optimum thermal paste conductivity characteristics
In addition to higher clock speeds, products with better thermal conductivity enable quieter cooling and longer component life
Compatible not only with computers or laptops, but also with PS3, PS4, PS5, Xbox 360, One and Series X consoles. Perfectly dissipates the heat from your Macbook

High-performance thermal pad with phase change material for optimal heat transfer
Easy to use and use
Package Content: 1 x PhaseSheet PTM Heat Pad
Excellent thermal conductivity for efficient cooling of CPU, GPU and other electronic components
Solid at room temperature, only liquefies from 45°C for easy application
Very low viscosity in liquid state for minimal thickness
Reduced pumping effect due to contraction during solidification
Non-electrically conductive, safe for sensitive electronics
Long-lasting performance with stable thermal conductivity after approximately 10 thermal cycles
Versatile in different cooling systems

Good product for use
Model Number: TG-MP8-30-30-10-1R
Dimensions: 30 x 30 x 1.0 (H) mm
Non-conductive
Usable temperature range: -100 °C - 250 °C

Since liquid metal paste, as the name suggests, is relatively liquid, the Thermal Grizzly applicators are the ideal aid for spreading the paste. With this pack you get three black Thermal Grizzly applicators , which allow the application or even distribution of a liquid metal thermal paste. However, The liquid metal thermal paste must not be used with aluminum contact surfaces and never comes into contact with electrically conductive components.CPU coolers with aluminum coldplate can not be used, instead the materials copper, nickel or silver are recommended. Especially with Intel Haswell, Devil's Canyon and Broadwell processors care must be taken that the liquid metal paste does not come into …

EXTREME HEAT CONDUCTIVITY - With a thermal conductivity of 14.2 W/(m·K), Kryonaut oers exceptional heat transfer, making it perfect for demanding configurations
EASY APPLICATION - The package includes a syringe and a specially designed applicator for effortless paste distribution
LONG-LASTING EFFECT - Kryonaut's unique structure ensures long-term eectiveness, remaining stable even at temperatures up to 80 degrees Celsius
IMPRESSIVE RESULTS - Experience an immediate temperature drop, reduced noise levels, and improved user comfort with this thermal solution
TOP PERFORMANCE - Backed by extensive testing, Kryonaut meets the highest quality standards, catering to both standard computer users a…

EXTREME HEAT CONDUCTIVITY - With exceptional thermal conductivity, Kryonaut is perfect for even the most demanding configurations and can be used in industrial cooling systems
EASY APPLICATION - Featuring a specially designed syringe and spatula for spreading, Kryonaut guarantees effortless, comfortable, and precise paste distribution on your processor or graphics card
LONG-LASTING EFFECT - Thanks to its unique and specialized structure, Kryonaut ensures long-lasting performance and does not dry out even at 80°C
SURPRISING IMPACT - Experience a temperature drop right from the first use, reducing device heat and enhancing operational comfort
MARKET LEADER - Proven through extensive testing, …

CPU Contact Frame The Thermal Grizzly Intel 1851 CPU Contact Frame V1 is a mounting aid for Intel motherboards with the LGA1851 socket. The contact frame replaces the standard ILM of the motherboard, optimizing the pressure applied to the CPU in the socket. This improves heat transfer from the CPU heat spreader to the CPU cooler. Product information "CPU Contact Frame - Intel 1851" The Intel 1851 CPU Contact Frame V1 is the version of the well-known mounting aid tailored to Intel motherboards with the LGA1851 socket. By using the Intel 1851 CPU Contact Frame V1, the concave bending of the CPU’s Integrated Heat Spreader (IHS) caused by the standard Integrated Loading Mechanism (ILM) is …

OPTIMIZED COOLING PERFORMANCE - Designed to improve the contact pressure, enhancing the cooling performance of CPU coolers and resulting in lower CPU temperatures
EASY INSTALLATION - Quick and hassle-free installation process, making it simple to upgrade your CPU cooling performance in just a few steps
LITE VERSION - Made by injection molding from acrylonitrile-butadiene-styrene copolymer with 15% fiberglass for added stability
DESIGNED BY DER8AUER - Developed in collaboration with renowned overclocker Roman "der8auer" Hartung and manufactured in Berlin - 100% Made in Germany
IMPROVED CONTACT - Special inner contour for optimal pressure distribution, preventing the concave curvature of the …

Thermal Conductivity: Grizzly thermal paste has extremely high conductivity, perfect for even the most demanding configurations.
Long Action: Conductonaut PS5 liquid metal has high thermal conductivity and is stable even with extended use. However, it CANNOT be used on aluminum components due to the risk of corrosion.
Exceptional Results: Using this thermal compound will immediately lower temperatures, reduce equipment noise, and improve user comfort.
Value for Money: Conductonaut is the best thermal paste for experienced users who want to enhance their system's thermals, as it provides up to 10 times more thermal conductivity than other thermal greases.
Liquid Metal: Thermal grizzly liquid …

High quality material.
The product meets the expectations of players and also the IT enthusiasts who are looking for a quality product with Thermal Grizzly.
CPU cooler
Temperature: -250°C / +150°C

High quality material.
The product meets the expectations of players and also the IT enthusiasts who are looking for a quality product with Thermal Grizzly.
CPU cooler
Temperature: -250°C / +150°C

Thermal Grizzly AM5 Lapping Tool im DetailThe AM5 Lapping Tool is designed to grind the heat spreaders of AMD's AM5 processor series. The tolerances of the AM5 lapping tool allow the heatspreader to be ground down in increments of 0.4 mm, up to a total height of 1.6 mm. When using the standard AMD mounting frame (SAM), a maximum grind of 1.0 mm is allowed until the middle steps are reached.A further 0.6 mm is only possible if the CPU is mounted with a suitable AM5 contact frame, for example (product will follow shortly). The steps of the AM5 lapping tool are diamond milled to achieve high transparency. This makes it clear when grinding which levels have already been reached and which have not.…

TG Remove is a special cleaner that has been specially developed to remove thermal paste . The nano-cleaner based on acetone achieves not only deep cleaning of surfaces, but also a degreasing effect. This allows both conventional thermal paste and liquid metal thermal paste to be removed safely and reliably.Due to the degreasing effect , the TG Remove cleaner is particularly suitable for optimally preparing the surface for use with Thermal Grizzly Conductonaut.Technical details:- Contents: 10 ml (for 10 to 20 applications)- Application temperature: room temperature- Colour: transparent- Viscosity: thin- Electrical conductivity *: 6.3 · 10? 7 S * m? 1- Typical application: CPUs, GPUs, notebooks, …

Intel 1851 Mycro Direct-Die Pro The Intel 1851 Mycro Direct-Die Pro RGB V1 is a water cooler optimized for the Intel LGA1851 platform, featuring a nickel-plated copper base plate and RGB lighting. The cold plate has micro cooling fins with low flow resistance. The cooler is placed directly on the chip of the delidded Intel CPU, ensuring the processor's heat takes the shortest possible path to the water loop. A list of all verified compatible processors is available online. Product information "Intel 1851 Mycro Direct-Die Pro - RGB" The Intel 1851 Mycro Direct-Die Pro RGB V1 features a jet system on the cooler's surface, and the slot width of the cooling channels has been optimized. The cooler’s …

The high performance thermal pad from Thermal Grizzly.Minus Pad 8 is based on a ceramic silicon formula and utilises correct compression thicknesses for optimum mounting and heat transferMinus Pad 8 offers a very elastic and adaptable surface with very high thermal conductivity. Even the smallest component can take full advantage of the transfer properties of this pad. Available in different dimensions and thicknesses.Features: - High thermal conductivity- High compressibility- Electrically insulatingSpecification: - W / mK 8.0, temperature range -100 ° C / + 200 ° C

The high performance thermal pad from Thermal Grizzly.Minus Pad 8 is based on a ceramic silicon formula and utilises correct compression thicknesses for optimum mounting and heat transferMinus Pad 8 offers a very elastic and adaptable surface with very high thermal conductivity. Even the smallest component can take full advantage of the transfer properties of this pad. Available in different dimensions and thicknesses.Features: - High thermal conductivity- High compressibility- Electrically insulatingSpecification: - W / mK 8.0, temperature range -100 ° C / + 200 ° C

The high performance thermal pad from Thermal Grizzly.Minus Pad 8 is based on a ceramic silicon formula and utilises correct compression thicknesses for optimum mounting and heat transferMinus Pad 8 offers a very elastic and adaptable surface with very high thermal conductivity. Even the smallest component can take full advantage of the transfer properties of this pad. Available in different dimensions and thicknesses.Features: - High thermal conductivity- High compressibility- Electrically insulatingSpecification: - W / mK 8.0, temperature range -100 ° C / + 200 ° C

- Simplifies CPU grinding - For Intel Core 13th Generation (Compatible with 12th Gen) - CNC milled acrylic glass - Complete set with sandpaper - Single use recommended The Thermal Grizzly Lapping Tool for the 12th and 13th Intel Generations in detail The lapping tool for Intel's 13th Gen processors enables the heat spreader to be safely sanded down. The CPU is easily mounted on the lapping tool using the included screws. The tolerances of the lapping tool allow the heat spreader to be ground down by 0.2 millimeters. The 13th Gen Lapping tool is compatible with 12th Generation Intel Core CPUs. Sandpaper in grit sizes 400, 1,200 and 2,500 is included. Optimize your cooling surface by sanding …

The Thermal Grizzly Delid-Die-Mate Intel 13th Gen in detailThe Thermal Grizzly Intel 13th Gen Delid-Die-Mate is a tool for removing the heatspreader ("head", "delidden") on Intel processors from the Alder Lake and Raptor Lake series. With the so-called "Direct Die", the CPU cooler is mounted directly on the processor chip. By omitting the heat spreader in the cooling circuit, a significantly optimized heat transfer from the dies to the CPU cooler is possible.Why Delidding & Direct Die Method on Intel Processors?During delidding, or "heading", the processor's heat spreader is removed. For unsoldered processors, delidden is typically used to replace the thermal interface (TIM) between the CPU …

Description:Tool for removing the heat spreader („delidding“) on AMD Ryzen 7000 processors.Properties:The Ryzen 7000 Delid-Die-Mate is a tool to safely delid the Ryzen 7000 processors. By removing the heat spreader, the CPUs can be cooled via Direct Die,for example. With the Direct Die, the CPU cooler is mounted directly on the CPU chiplets and the I/O die, which enables a significantly optimised heat transfer.Unit Value/Description- Length: 74 mm- Width: 70,1 mm- Height: 19,8 mm- Material: Aluminium, anodised- Color: Black, red

Description:The Ryzen 7000 Direct Die Frame is a CPU mounting frame for installing Ryzen 7000 processors without the integrated heat spreader.iProperties:The heat spreader of the Ryzen 7000 processors is very thick, which is partly due to the compatibility with older CPU coolers for the AM4 socket. The un-necessary thickness of the heat spreader reduces the thermal conductivity, so that the CPUs are operated at very high temperatures, which are around 95 degrees Celsius.By removing the heat spreader („decapitating“, „delidding“), the CPU cooler can be mounted directly on the chiplets of the Ryzen 7000 CPU, drastically reducing temperatures.To avoid damage to the sensitive …

Description:Backplate to extend cooler compatibility for AM5 motherboards from AMDProperties:The AM5 Short Backplate is a shortened mounting plate that replaces the original AM5 backplate. Some CPU coolers compatible with the AM4 socket use a custom retention kit for mounting. Since the AM4 backplate is primarily used for mounting coolers, omitting this backplate is generally not a problem.However, with the AM5 socket, the Socket Actuation Mechanism (SAM) is also screwed on via the backplate and cannot simply be omitted. In order to usean AM4-compatible cooler with a custom retention kit, you need an alternative holder for the SAM of the motherboard.This is where the AM5 Short Backplatecomes …