Computer Cooling Thermal Grizzly

TG Shield was specially developed to protect sensitive components such as the components around the CPU or GPU die. The paint reliably insulates against liquids and electricity . So you don't have to worry about damage or short circuits when applying liquid metal or other electrically conductive heat transfer agents.The protective varnish has been optimized for quick drying and only takes 30 minutes to fully cure at 20 degrees room temperature. The integrated brush enables precise and easy application.The content of 5 ml is for about 10 to 20 applicationssufficient, depending on the size of the CPU or GPU. The high application temperature of -20 ° C to 110 ° C enables use on all common CPUs an…

Suitable for all Thermal Grizzly pastes: Aeronaut, HYDRONAUT, KRYONAUT and KRYONAUT EXTREME
This thermal paste applicator allows for an even and precise distribution of the paste on the processor without risk of introducing contamination
Correct thermal paste application is essential to achieve optimum thermal paste conductivity characteristics
In addition to higher clock speeds, products with better thermal conductivity enable quieter cooling and longer component life
Compatible not only with computers or laptops, but also with PS3, PS4, PS5, Xbox 360, One and Series X consoles. Perfectly dissipates the heat from your Macbook

High-performance thermal pad with phase change material for optimal heat transfer
Easy to use and use
Package Content: 1 x PhaseSheet PTM Heat Pad
Excellent thermal conductivity for efficient cooling of CPU, GPU and other electronic components
Solid at room temperature, only liquefies from 45°C for easy application
Very low viscosity in liquid state for minimal thickness
Reduced pumping effect due to contraction during solidification
Non-electrically conductive, safe for sensitive electronics
Long-lasting performance with stable thermal conductivity after approximately 10 thermal cycles
Versatile in different cooling systems

The high performance thermal pad from Thermal Grizzly.Minus Pad 8 is based on a ceramic silicon formula and utilises correct compression thicknesses for optimum mounting and heat transferMinus Pad 8 offers a very elastic and adaptable surface with very high thermal conductivity. Even the smallest component can take full advantage of the transfer properties of this pad. Available in different dimensions and thicknesses.Features: - High thermal conductivity- High compressibility- Electrically insulatingSpecification: - W / mK 8.0, temperature range -100 ° C / + 200 ° C

Good product for use
Model Number: TG-MP8-30-30-10-1R
Dimensions: 30 x 30 x 1.0 (H) mm
Non-conductive
Usable temperature range: -100 °C - 250 °C

EXTREME HEAT CONDUCTIVITY - With a thermal conductivity of 14.2 W/(m·K), Kryonaut oers exceptional heat transfer, making it perfect for demanding configurations
EASY APPLICATION - The package includes a syringe and a specially designed applicator for effortless paste distribution
LONG-LASTING EFFECT - Kryonaut's unique structure ensures long-term eectiveness, remaining stable even at temperatures up to 80 degrees Celsius
IMPRESSIVE RESULTS - Experience an immediate temperature drop, reduced noise levels, and improved user comfort with this thermal solution
TOP PERFORMANCE - Backed by extensive testing, Kryonaut meets the highest quality standards, catering to both standard computer users a…

EXTREME HEAT CONDUCTIVITY - With exceptional thermal conductivity, Kryonaut is perfect for even the most demanding configurations and can be used in industrial cooling systems
EASY APPLICATION - Featuring a specially designed syringe and spatula for spreading, Kryonaut guarantees effortless, comfortable, and precise paste distribution on your processor or graphics card
LONG-LASTING EFFECT - Thanks to its unique and specialized structure, Kryonaut ensures long-lasting performance and does not dry out even at 80°C
SURPRISING IMPACT - Experience a temperature drop right from the first use, reducing device heat and enhancing operational comfort
MARKET LEADER - Proven through extensive testing, …

73W/(m·K) THERMAL CONDUCTIVITY - Extremely high conductivity, perfect for even the most demanding configurations.
LONG ACTION - Conductonaut has high thermal conductivity and is stable even with extended use. However, it CANNOT be used on aluminum components due to the risk of corrosion.
EXEPTIONAL RESUTLS - Using this thermal compound will immediately lower temperatures, reducing equipment noise and improving user comfort.
GREAT VALUE FOR MONEY - Conductonaut is an excellent choice for experienced users who want to enhance their system's thermals, as it provides up to 10 times more thermal conductivity than other thermal greases.
1 GRAMM - useable for up to 6 CPUs (depending on diy size)…

Made of carbon-based polymer with nanoparticles, it has a high thermal conductivity of 62.5 W / mk
The non-adhesive and flexible carbon fibre thermal pad can be used repeatedly and, unlike pastes, does not dry out!
The product meets the expectations of both players and IT enthusiasts, who are looking for a high quality product with Thermal Grizzly.
The material of which the thermal pad is made is practically not subject to any processes of decomposition, so its properties are constant and its life span is almost unlimited (even 15 years is said to be).
It is suitable for cooling CPUs, GPUs and wherever it is required to use pads instead of thermally conductive pastes. Carbonaut is an electrical …

Thermal Grizzly AM5 Lapping Tool im DetailThe AM5 Lapping Tool is designed to grind the heat spreaders of AMD's AM5 processor series. The tolerances of the AM5 lapping tool allow the heatspreader to be ground down in increments of 0.4 mm, up to a total height of 1.6 mm. When using the standard AMD mounting frame (SAM), a maximum grind of 1.0 mm is allowed until the middle steps are reached.A further 0.6 mm is only possible if the CPU is mounted with a suitable AM5 contact frame, for example (product will follow shortly). The steps of the AM5 lapping tool are diamond milled to achieve high transparency. This makes it clear when grinding which levels have already been reached and which have not.…

TG Remove is a special cleaner that has been specially developed to remove thermal paste . The nano-cleaner based on acetone achieves not only deep cleaning of surfaces, but also a degreasing effect. This allows both conventional thermal paste and liquid metal thermal paste to be removed safely and reliably.Due to the degreasing effect , the TG Remove cleaner is particularly suitable for optimally preparing the surface for use with Thermal Grizzly Conductonaut.Technical details:- Contents: 10 ml (for 10 to 20 applications)- Application temperature: room temperature- Colour: transparent- Viscosity: thin- Electrical conductivity *: 6.3 · 10? 7 S * m? 1- Typical application: CPUs, GPUs, notebooks, …

The high performance thermal pad from Thermal Grizzly.Minus Pad 8 is based on a ceramic silicon formula and utilises correct compression thicknesses for optimum mounting and heat transferMinus Pad 8 offers a very elastic and adaptable surface with very high thermal conductivity. Even the smallest component can take full advantage of the transfer properties of this pad. Available in different dimensions and thicknesses.Features: - High thermal conductivity- High compressibility- Electrically insulatingSpecification: - W / mK 8.0, temperature range -100 ° C / + 200 ° C

The high performance thermal pad from Thermal Grizzly.Minus Pad 8 is based on a ceramic silicon formula and utilises correct compression thicknesses for optimum mounting and heat transferMinus Pad 8 offers a very elastic and adaptable surface with very high thermal conductivity. Even the smallest component can take full advantage of the transfer properties of this pad. Available in different dimensions and thicknesses.Features: - High thermal conductivity- High compressibility- Electrically insulatingSpecification: - W / mK 8.0, temperature range -100 ° C / + 200 ° C

- Simplifies CPU grinding - For Intel Core 13th Generation (Compatible with 12th Gen) - CNC milled acrylic glass - Complete set with sandpaper - Single use recommended The Thermal Grizzly Lapping Tool for the 12th and 13th Intel Generations in detail The lapping tool for Intel's 13th Gen processors enables the heat spreader to be safely sanded down. The CPU is easily mounted on the lapping tool using the included screws. The tolerances of the lapping tool allow the heat spreader to be ground down by 0.2 millimeters. The 13th Gen Lapping tool is compatible with 12th Generation Intel Core CPUs. Sandpaper in grit sizes 400, 1,200 and 2,500 is included. Optimize your cooling surface by sanding …

CPU Contact Frame The Thermal Grizzly Intel 1851 CPU Contact Frame V1 is a mounting aid for Intel motherboards with the LGA1851 socket. The contact frame replaces the standard ILM of the motherboard, optimizing the pressure applied to the CPU in the socket. This improves heat transfer from the CPU heat spreader to the CPU cooler. Product information "CPU Contact Frame - Intel 1851" The Intel 1851 CPU Contact Frame V1 is the version of the well-known mounting aid tailored to Intel motherboards with the LGA1851 socket. By using the Intel 1851 CPU Contact Frame V1, the concave bending of the CPU’s Integrated Heat Spreader (IHS) caused by the standard Integrated Loading Mechanism (ILM) is …

German Engineered - quality from Berlin The Intel 13th and 14th Gen CPU Contact Frame is a mounting aid that replaces the motherboard's original Integrated Loading Mechanism (ILM) to enable better cooling performance of CPU coolers through optimized contact pressure. Due to the changed dimensions of the Intel Raptor Lake (Intel Core 13th and 14th Gen) for the Intel Socket LGA1700 compared to the Socket 1200 processors (and older generations, such as Socket LGA115X) as well as the associated changes to the dimensions of the socket, New mounting brackets for CPU coolers have become necessary. Additionally, the standard ILM only has contact points in the middle of the elongated CPU. Due to the …

The Thermal Grizzly Delid-Die-Mate Intel 13th Gen in detailThe Thermal Grizzly Intel 13th Gen Delid-Die-Mate is a tool for removing the heatspreader ("head", "delidden") on Intel processors from the Alder Lake and Raptor Lake series. With the so-called "Direct Die", the CPU cooler is mounted directly on the processor chip. By omitting the heat spreader in the cooling circuit, a significantly optimized heat transfer from the dies to the CPU cooler is possible.Why Delidding & Direct Die Method on Intel Processors?During delidding, or "heading", the processor's heat spreader is removed. For unsoldered processors, delidden is typically used to replace the thermal interface (TIM) between the CPU …

Description:Tool for removing the heat spreader („delidding“) on AMD Ryzen 7000 processors.Properties:The Ryzen 7000 Delid-Die-Mate is a tool to safely delid the Ryzen 7000 processors. By removing the heat spreader, the CPUs can be cooled via Direct Die,for example. With the Direct Die, the CPU cooler is mounted directly on the CPU chiplets and the I/O die, which enables a significantly optimised heat transfer.Unit Value/Description- Length: 74 mm- Width: 70,1 mm- Height: 19,8 mm- Material: Aluminium, anodised- Color: Black, red

Description:The Ryzen 7000 Direct Die Frame is a CPU mounting frame for installing Ryzen 7000 processors without the integrated heat spreader.iProperties:The heat spreader of the Ryzen 7000 processors is very thick, which is partly due to the compatibility with older CPU coolers for the AM4 socket. The un-necessary thickness of the heat spreader reduces the thermal conductivity, so that the CPUs are operated at very high temperatures, which are around 95 degrees Celsius.By removing the heat spreader („decapitating“, „delidding“), the CPU cooler can be mounted directly on the chiplets of the Ryzen 7000 CPU, drastically reducing temperatures.To avoid damage to the sensitive …

Description:Backplate to extend cooler compatibility for AM5 motherboards from AMDProperties:The AM5 Short Backplate is a shortened mounting plate that replaces the original AM5 backplate. Some CPU coolers compatible with the AM4 socket use a custom retention kit for mounting. Since the AM4 backplate is primarily used for mounting coolers, omitting this backplate is generally not a problem.However, with the AM5 socket, the Socket Actuation Mechanism (SAM) is also screwed on via the backplate and cannot simply be omitted. In order to usean AM4-compatible cooler with a custom retention kit, you need an alternative holder for the SAM of the motherboard.This is where the AM5 Short Backplatecomes …

Description:Backplate to extend cooler compatibility for AM5 motherboards from AMDProperties:The AM5 M4 backplate is an optional mounting plate that replaces the original AM5 backplate. Some CPU coolers use a mounting kit that comes with M4threaded screws. These are not compatible with the UNC 6-32 thread used on the AM5 backplate. With the AM5 M4 backplate, appropriate CPU coolers, especially AiO watercoolers, can be used.Unit Value/Description- Length: 104 mm- Width: 65mm- Height: 3 mm- Material: Anodised aluminium, polycarbonate

AM5 Adapter & Offset Mounting Kit in DetailThe practical AM5 Adapter & Offset Mounting Kit for AMD socket AM5 mainboards includes cooler brackets for offset mounting of the CPU, as well as adapter screws from UNC 6-32 to M3 and M4 threads.The adapter screws can be used to mount CPU coolers that require an M3 or M4 thread instead of the UNC 6-32 thread of the cooler bracket fastening screws, as is the case with various AIOs or water coolers.With the offset brackets, compatible CPU coolers can optionally be mounted offset on the processor to optimize cooling performance. Since the introduction of the chiplet design in Ryzen CPUs, the hottest point of the heat spreader is no longer in the middle,…