Computer Cooling

FIT:For AMD AM5 platform protection: Suitable for AMD7950X 7900X 7700X 7600X Anti-silicone grease overflow: Prevent the accumulation of heat...

35g Grey Thermal Paste Grease Compound Silicone For Graphics CPU Heatsink. Feature: Grey thermal paste. Syringe desing,easy to operation.

Description The thermal grease is designed to meet the needs of both casual users and gamers. Its high thermal conductivity and easy application...

SYY Thermal Paste, 8g with Toolkit New Upgrade Easy to Apply CPU Thermal Compound Paste Heatsink for IC/Processor/CPU/Coolers, Carbon Based High...

SYY Thermal Paste, 40g with 4 Toolkit SYY Thermal Paste, 40g with 4 Toolkit Brand: SYY Size: 40g Manufacturer: SYY

Thermal paste 220 C rating, 30g/tube, 5.15W/m-k thermal conductivity, -55~220C, syringe packing. Thermal Paste 220 C rating, 30g/tube is...

new and high quality PTM7950 is a super highly thermally conductive Phase Change Material (PCM) in both pad and paste formats. It is designed to...

1 one enjoy Thermal Pad 12.8 W/mK, 85x45mm, Non Conductive Heat Resistance High Temperature Resistance, Silicone Thermal Pads for Laptop...

1 one enjoy Thermal Pad 12.8 W/mK, 85x45mm, Non Conductive Heat Resistance High Temperature Resistance, Silicone Thermal Pads for Laptop...

1 one enjoy Thermal Pad 12.8 W/mK, 85x45mm, Non Conductive Heat Resistance High Temperature Resistance, Silicone Thermal Pads for Laptop...

LenovothermalmoduleforUMA

TG Remove is a special cleaner that has been specially developed to remove thermal paste . The nano-cleaner based on acetone achieves not only deep cleaning of surfaces, but also a degreasing effect. This allows both conventional thermal paste and liquid metal thermal paste to be removed safely and reliably.Due to the degreasing effect , the TG Remove cleaner is particularly suitable for optimally preparing the surface for use with Thermal Grizzly Conductonaut.Technical details:- Contents: 10 ml (for 10 to 20 applications)- Application temperature: room temperature- Colour: transparent- Viscosity: thin- Electrical conductivity *: 6.3 · 10? 7 S * m? 1- Typical application: CPUs, GPUs, notebooks, …

- Simplifies CPU grinding - For Intel Core 13th Generation (Compatible with 12th Gen) - CNC milled acrylic glass - Complete set with sandpaper - Single use recommended The Thermal Grizzly Lapping Tool for the 12th and 13th Intel Generations in detail The lapping tool for Intel's 13th Gen processors enables the heat spreader to be safely sanded down. The CPU is easily mounted on the lapping tool using the included screws. The tolerances of the lapping tool allow the heat spreader to be ground down by 0.2 millimeters. The 13th Gen Lapping tool is compatible with 12th Generation Intel Core CPUs. Sandpaper in grit sizes 400, 1,200 and 2,500 is included. Optimize your cooling surface by sanding …

Thermal Grizzly AM5 Lapping Tool im DetailThe AM5 Lapping Tool is designed to grind the heat spreaders of AMD's AM5 processor series. The tolerances of the AM5 lapping tool allow the heatspreader to be ground down in increments of 0.4 mm, up to a total height of 1.6 mm. When using the standard AMD mounting frame (SAM), a maximum grind of 1.0 mm is allowed until the middle steps are reached.A further 0.6 mm is only possible if the CPU is mounted with a suitable AM5 contact frame, for example (product will follow shortly). The steps of the AM5 lapping tool are diamond milled to achieve high transparency. This makes it clear when grinding which levels have already been reached and which have not.…

Description:The Ryzen 7000 Direct Die Frame is a CPU mounting frame for installing Ryzen 7000 processors without the integrated heat spreader.iProperties:The heat spreader of the Ryzen 7000 processors is very thick, which is partly due to the compatibility with older CPU coolers for the AM4 socket. The un-necessary thickness of the heat spreader reduces the thermal conductivity, so that the CPUs are operated at very high temperatures, which are around 95 degrees Celsius.By removing the heat spreader („decapitating“, „delidding“), the CPU cooler can be mounted directly on the chiplets of the Ryzen 7000 CPU, drastically reducing temperatures.To avoid damage to the sensitive …

Description:Tool for removing the heat spreader („delidding“) on AMD Ryzen 7000 processors.Properties:The Ryzen 7000 Delid-Die-Mate is a tool to safely delid the Ryzen 7000 processors. By removing the heat spreader, the CPUs can be cooled via Direct Die,for example. With the Direct Die, the CPU cooler is mounted directly on the CPU chiplets and the I/O die, which enables a significantly optimised heat transfer.Unit Value/Description- Length: 74 mm- Width: 70,1 mm- Height: 19,8 mm- Material: Aluminium, anodised- Color: Black, red

The high performance thermal pad from Thermal Grizzly.Minus Pad 8 is based on a ceramic silicon formula and utilises correct compression thicknesses for optimum mounting and heat transferMinus Pad 8 offers a very elastic and adaptable surface with very high thermal conductivity. Even the smallest component can take full advantage of the transfer properties of this pad. Available in different dimensions and thicknesses.Features: - High thermal conductivity- High compressibility- Electrically insulatingSpecification: - W / mK 8.0, temperature range -100 ° C / + 200 ° C

The high performance thermal pad from Thermal Grizzly.Minus Pad 8 is based on a ceramic silicon formula and utilises correct compression thicknesses for optimum mounting and heat transferMinus Pad 8 offers a very elastic and adaptable surface with very high thermal conductivity. Even the smallest component can take full advantage of the transfer properties of this pad. Available in different dimensions and thicknesses.Features: - High thermal conductivity- High compressibility- Electrically insulatingSpecification: - W / mK 8.0, temperature range -100 ° C / + 200 ° C

The Thermal Grizzly Delid-Die-Mate Intel 13th Gen in detailThe Thermal Grizzly Intel 13th Gen Delid-Die-Mate is a tool for removing the heatspreader ("head", "delidden") on Intel processors from the Alder Lake and Raptor Lake series. With the so-called "Direct Die", the CPU cooler is mounted directly on the processor chip. By omitting the heat spreader in the cooling circuit, a significantly optimized heat transfer from the dies to the CPU cooler is possible.Why Delidding & Direct Die Method on Intel Processors?During delidding, or "heading", the processor's heat spreader is removed. For unsoldered processors, delidden is typically used to replace the thermal interface (TIM) between the CPU …

Specification: 1.Model: HY810-TU20Q; 2.Thermal Conductivity: >4.63W / m-K; 3.Thermal Impedance:

Chip model: TEC2-19008 Dimensions: 40x40x6.3mm Maximum temperature difference: Tmax (Qc=0) above 80. Working current: =8A (at rated voltage startup)...

Chip model: TEC2-19008 Dimensions: 40x40x6.3mm Maximum temperature difference: Tmax (Qc=0) above 80. Working current: =8A (at rated voltage startup)...

new and high quality PTM7950 is a super highly thermally conductive Phase Change Material (PCM) in both pad and paste formats. It is designed to...

new and high quality PTM7950 is a super highly thermally conductive Phase Change Material (PCM) in both pad and paste formats. It is designed to...