MSI MEG X670E GODLIKE

An extremely expensive, high-performance, large-size (E-ATX) Hi-End motherboard designed to set overclocking records and embarrass the competition. In fact, this model claims to be the largest and most “stuffed” board with an AM5 connector, hence the modest name Godlike. Among the main features of the device are advanced circuitry built on the basis of heat-resistant Japanese capacitors, a 27-phase power supply, a massive VRM radiator, M.2 Frozr radiators with magnetic fastenings, comprehensive cooling of power circuits and very powerful MOSFETs that allow you to squeeze the last megahertz out of the processor.

At the same time, it is impressive and slightly intimidating with its dimensions (almost 30 by 30 cm), so everyone who wants to buy this miracle of engineering should double-check the dimensions of the case, since not all cases designed for E-ATX models will fit. All this directly suggests that the MSI MEG X670E GODLIKE is created for hardcore gamers and overclocking enthusiasts who are ready to invest crazy money from the point of view of an ordinary buyer for the top-end hardware.

The board runs the top-end AMD X670 system logic and is compatible with Ryzen 7000 and 8000 series processors, designed for a completely new processor socket and AMD AM5 platform. It is possible to install up to 192 GB of DDR5 RAM with a frequency of up to 6666 MHz and connect up to four high-speed NVMe SSD drives with Frozr aluminium radiators on magnetic mounts. The dual network controller (Marvell AQC113CS and Killer E3100G) provides 12.5 Gbps network throughput, as well as built-in module for Wi-Fi 6E and Bluetooth 5.2. The ALC4082 audio subsystem with the ESS ES9280AQ amplifier guarantees excellent sound quality. In addition, the board has advanced tools for overclocking components and is equipped with a large number of free areas for placing water pumps.